AMD Xilinx
XCV200E-6BG352I
XCV200E-6BG352I ECAD Model
XCV200E-6BG352I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 260 | |
| Number of Outputs | 260 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV200E-6BG352I Datasheet Download
XCV200E-6BG352I Overview
Chip model XCV200E-6BG352I is a powerful tool for modern communication systems. It is a high-performance, low-power, low-cost, and highly integrated SoC (System-on-Chip) that combines multiple functions, such as analog, digital, and RF (Radio Frequency) components, into one integrated circuit. It is designed for use in various communication systems, including cellular, satellite, and wireless systems.
The XCV200E-6BG352I chip model has several advantages over other chip models. It is small and lightweight, making it ideal for use in mobile devices. It is also highly energy-efficient, meaning it can be used in battery-powered systems without significantly reducing battery life. Additionally, the chip model is highly integrated, allowing for the integration of multiple functions into one chip. This reduces the complexity of the system, making it easier to design and debug.
In terms of expected demand trends for the chip model XCV200E-6BG352I, the demand for this model is expected to increase in the future. This is due to the increasing demand for communication systems and the need for more efficient and compact solutions. Additionally, the chip model is expected to be used in more advanced communication systems, such as 5G networks and the Internet of Things (IoT).
The original design intention of the chip model XCV200E-6BG352I was to provide a highly integrated and low-power solution for communication systems. This design intention has been successful, as the chip model has been used in various communication systems, such as cellular, satellite, and wireless systems. Additionally, the chip model is capable of being upgraded and improved, meaning it can be used in more advanced communication systems in the future.
The chip model XCV200E-6BG352I can also be used in networks and intelligent scenarios. It can be used in networks such as 5G networks and the Internet of Things (IoT). Additionally, it can be used in intelligent scenarios, such as autonomous driving, smart homes, and smart cities. This chip model is also capable of being used in the era of fully intelligent systems, such as artificial intelligence (AI) and machine learning (ML).
In conclusion, the chip model XCV200E-6BG352I is a powerful and efficient tool for modern communication systems. It is highly integrated, low-power, and lightweight, making it ideal for use in mobile devices. Additionally, it is capable of being upgraded and improved, meaning it can be used in more advanced communication systems in the future. Furthermore, it can be used in networks and intelligent scenarios, such as 5G networks, the Internet of Things (IoT), autonomous driving, and artificial intelligence (AI). The demand for this chip model is expected to increase in the future, making it a great choice for communication system designers.
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