
AMD Xilinx
XCV2000E-8BGG560I
XCV2000E-8BGG560I ECAD Model
XCV2000E-8BGG560I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 404 | |
Number of Outputs | 404 | |
Number of Logic Cells | 43200 | |
Number of Equivalent Gates | 518400 | |
Number of CLBs | 9600 | |
Combinatorial Delay of a CLB-Max | 400 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 9600 CLBS, 518400 GATES | |
Clock Frequency-Max | 416 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B560 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 560 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA560,33X33,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LBGA, BGA560,33X33,50 | |
Pin Count | 560 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV2000E-8BGG560I Datasheet Download
XCV2000E-8BGG560I Overview
The XCV2000E-8BGG560I chip model is an advanced integrated circuit system designed for high-performance digital signal processing, embedded processing, image processing, and other related applications. It is a highly integrated, low-power, and cost-effective solution for a variety of applications.
The XCV2000E-8BGG560I chip model is based on a 16-bit RISC processor core and a variety of peripherals, including a digital signal processor (DSP), a memory management unit (MMU), a memory controller, and a direct memory access controller (DMAC). The chip model supports multiple instruction set architectures (ISAs) and provides multiple clock frequencies, enabling users to customize their designs with the most suitable architecture and clock frequency.
The XCV2000E-8BGG560I chip model also provides an embedded system design platform, which enables users to develop applications with a variety of software development tools. The chip model supports the development of applications in HDL (Hardware Description Language) and C language, allowing users to develop their own application-specific solutions.
The XCV2000E-8BGG560I chip model is suitable for a wide range of applications, including digital signal processing, embedded processing, and image processing. It provides a powerful platform for the development and popularization of future intelligent robots. To use the model effectively, technical talents including embedded system designers, software engineers, and hardware engineers are required.
When designing with the XCV2000E-8BGG560I chip model, it is important to consider several factors, such as power consumption, memory size, and system performance. It is also important to pay attention to the design of the system architecture, as well as the selection of the appropriate ISA and clock frequency. Furthermore, the system should be tested thoroughly before deployment to ensure that it meets the design requirements.
Case studies from successful applications of the XCV2000E-8BGG560I chip model can provide valuable insights into how to effectively use the model. For example, one case study describes the development of a system for image processing using the XCV2000E-8BGG560I chip model. The system was designed to process image data in real-time and was tested to ensure that it met the performance requirements.
In conclusion, the XCV2000E-8BGG560I chip model is an advanced integrated circuit system suitable for a wide range of applications, including digital signal processing, embedded processing, and image processing. It provides a powerful platform for the development and popularization of future intelligent robots. To use the model effectively, technical talents including embedded system designers, software engineers, and hardware engineers are required. It is important to consider several factors when designing with the XCV2000E-8BGG560I chip model, and case studies from successful applications of the model can provide valuable insights into how to effectively use the model.
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1,200 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,305.7200 | $1,305.7200 |
10+ | $1,291.6800 | $12,916.8000 |
100+ | $1,221.4800 | $122,148.0000 |
1000+ | $1,151.2800 | $575,640.0000 |
10000+ | $1,053.0000 | $1,053,000.0000 |
The price is for reference only, please refer to the actual quotation! |