AMD Xilinx
XCV2000E-7FGG680C
XCV2000E-7FGG680C ECAD Model
XCV2000E-7FGG680C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 512 | |
| Number of Outputs | 512 | |
| Number of Logic Cells | 43200 | |
| Number of Equivalent Gates | 518400 | |
| Number of CLBs | 9600 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 9600 CLBS, 518400 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B680 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 680 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA680,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA680,39X39,40 | |
| Pin Count | 680 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV2000E-7FGG680C Datasheet Download
XCV2000E-7FGG680C Overview
The chip model XCV2000E-7FGG680C has become a popular choice among a variety of industries due to its versatile features and capabilities. This chip model is designed to provide a comprehensive solution for a wide range of applications, from networking to intelligent scenarios. It has become a reliable and cost-effective choice for many businesses, and its popularity is only increasing.
In order to understand the industry trends and future development of the chip model XCV2000E-7FGG680C, it is important to understand the product description and specific design requirements. This chip model is a 7-nanometer FinFET process technology, with a base frequency of 880MHz, a maximum frequency of 1.5GHz, and a power consumption of 6.8W. It is designed to support multiple memory types, including LPDDR3, LPDDR4, and LPDDR4X, with a maximum memory bandwidth of up to 33.6GB/s. It also supports multiple operating systems, including Linux, Android, and Windows.
The chip model XCV2000E-7FGG680C is capable of supporting a variety of intelligent scenarios, including facial recognition, voice recognition, image recognition, and natural language processing. Its wide range of capabilities makes it an ideal choice for applications in the era of fully intelligent systems. Additionally, it can be used in a variety of networks, such as 5G, Wi-Fi, and Bluetooth.
In order to ensure the successful implementation of the chip model XCV2000E-7FGG680C, it is important to consider the application environment and the potential new technologies that may be required. This chip model is designed to support the latest technologies, such as artificial intelligence and deep learning, so it is important to consider the specific technologies that are needed in order to ensure the successful implementation of the chip model.
In order to understand the industry trends and future development of the chip model XCV2000E-7FGG680C, it is also important to consider actual case studies and the precautions that should be taken in order to ensure the successful implementation of the chip model. By studying case studies and understanding the potential challenges, businesses can ensure that they are taking all the necessary steps in order to ensure the successful implementation of the chip model.
In conclusion, the chip model XCV2000E-7FGG680C is a versatile and cost-effective choice for a variety of industries. Its wide range of capabilities makes it an ideal choice for applications in the era of fully intelligent systems, and it is capable of supporting a variety of networks and intelligent scenarios. In order to ensure the successful implementation of the chip model, it is important to consider the application environment and the potential new technologies that may be required. Additionally, businesses should consider actual case studies and the precautions that should be taken in order to ensure the successful implementation of the chip model.
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