AMD Xilinx
XCV2000E-7BGG560C
XCV2000E-7BGG560C ECAD Model
XCV2000E-7BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 43200 | |
| Number of Equivalent Gates | 518400 | |
| Number of CLBs | 9600 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 9600 CLBS, 518400 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA560,33X33,50 | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV2000E-7BGG560C Datasheet Download
XCV2000E-7BGG560C Overview
The XCV2000E-7BGG560C chip model is the latest in a long line of cutting-edge technology designed to meet the ever-evolving needs of the modern world. This chip model is designed with a number of advantages that make it an ideal choice for a variety of applications. It is a highly reliable and cost-effective solution for a range of industries, from consumer electronics to automotive and industrial applications.
The XCV2000E-7BGG560C chip model is designed to provide high performance and reliability in a wide range of environments. It is designed to be highly energy efficient, with low power consumption, and is capable of operating in extreme temperatures. It is also designed with a number of features to enhance its performance, such as its high-speed data processing capability, its advanced security features, and its robust design.
The XCV2000E-7BGG560C chip model is expected to experience a growing demand in the coming years, as its features and capabilities become more widely recognized. It is expected to be a popular choice for a variety of applications, such as consumer electronics, automotive, and industrial applications. Its advanced features and capabilities make it an ideal choice for a variety of applications, including those that require high performance and reliability.
The original design intention of the XCV2000E-7BGG560C chip model was to provide a reliable, cost-effective solution for a variety of applications. It is designed to be highly energy efficient and capable of operating in extreme temperatures. It is also designed with a number of features to enhance its performance, such as its high-speed data processing capability, its advanced security features, and its robust design.
The XCV2000E-7BGG560C chip model is also designed with the possibility of future upgrades in mind. This allows it to remain relevant and up-to-date in the ever-evolving world of technology. It is also capable of being applied to advanced communication systems, such as 5G networks, due to its high-speed data processing capabilities and advanced security features.
The product description and specific design requirements of the XCV2000E-7BGG560C chip model are available from the manufacturer. It is important to note that the chip model should be installed and operated in accordance with the manufacturer’s instructions. It is also important to ensure that any upgrades or modifications are done in accordance with the manufacturer’s recommendations.
Case studies of the XCV2000E-7BGG560C chip model have been conducted in a number of industries, including automotive, consumer electronics, and industrial applications. These studies have shown that the chip model is highly reliable and cost-effective, and is capable of meeting the needs of a variety of applications.
In conclusion, the XCV2000E-7BGG560C chip model is a highly reliable and cost-effective solution for a variety of applications. It is designed with a number of features to enhance its performance, such as its high-speed data processing capability, its advanced security features, and its robust design. It is expected to experience a growing demand in the coming years, and is capable of being applied to advanced communication systems. It is important to ensure that any upgrades or modifications are done in accordance with the manufacturer’s recommendations, and that the chip model is installed and operated in accordance with the manufacturer’s instructions.
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5,953 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,070.4077 | $1,070.4077 |
| 10+ | $1,058.8979 | $10,588.9792 |
| 100+ | $1,001.3491 | $100,134.9120 |
| 1000+ | $943.8003 | $471,900.1600 |
| 10000+ | $863.2320 | $863,232.0000 |
| The price is for reference only, please refer to the actual quotation! | ||