AMD Xilinx
XCV2000E-6FGG680I
XCV2000E-6FGG680I ECAD Model
XCV2000E-6FGG680I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 512 | |
| Number of Outputs | 512 | |
| Number of Logic Cells | 43200 | |
| Number of Equivalent Gates | 518400 | |
| Number of CLBs | 9600 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 9600 CLBS, 518400 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B680 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 680 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA680,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA680,39X39,40 | |
| Pin Count | 680 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV2000E-6FGG680I Datasheet Download
XCV2000E-6FGG680I Overview
The XCV2000E-6FGG680I chip model is a high-performance, low-power integrated circuit designed for digital signal processing, embedded processing, and image processing. It has been designed to use the HDL language, a hardware description language, for its development and programming. This chip model is particularly well-suited for applications that require high-performance and low-power consumption, such as those found in the automation and robotics industry.
The XCV2000E-6FGG680I chip model is designed to meet the needs of the industry and to provide the best performance and power efficiency possible. It has been designed to be easily upgradeable, allowing for future developments and upgrades to be implemented. This chip model also has the potential to be applied to advanced communication systems.
As the industry trends change and new technologies become available, the XCV2000E-6FGG680I chip model may need to be updated to meet the new requirements. This could include the addition of new features, such as support for more advanced communication protocols, or the implementation of new algorithms that increase its performance.
The original design intention of the XCV2000E-6FGG680I chip model was to provide a high-performance and low-power solution for digital signal processing, embedded processing, and image processing applications. It was designed to be easily upgradeable, allowing for future developments and upgrades to be implemented. It also has the potential to be applied to advanced communication systems, making it a versatile solution for many applications.
In conclusion, the XCV2000E-6FGG680I chip model is a powerful, low-power integrated circuit that is well-suited for digital signal processing, embedded processing, and image processing applications. It is designed to be easily upgradeable, allowing for future developments and upgrades to be implemented. It also has the potential to be applied to advanced communication systems, making it a versatile solution for many applications.
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