AMD Xilinx
XCV2000E-6FGG680C
XCV2000E-6FGG680C ECAD Model
XCV2000E-6FGG680C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 512 | |
| Number of Outputs | 512 | |
| Number of Logic Cells | 43200 | |
| Number of Equivalent Gates | 518400 | |
| Number of CLBs | 9600 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 9600 CLBS, 518400 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B680 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 680 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA680,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA680,39X39,40 | |
| Pin Count | 680 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV2000E-6FGG680C Datasheet Download
XCV2000E-6FGG680C Overview
The chip model XCV2000E-6FGG680C is a powerful and reliable component that can be used in a wide range of applications. It is designed to provide high performance and reliable operation in a variety of environments. With its advanced features and design, the XCV2000E-6FGG680C is suitable for a variety of networks and intelligent scenarios.
The XCV2000E-6FGG680C is designed with the latest technologies to ensure maximum performance and reliability. It is capable of handling large amounts of data and can be used in high-performance applications such as data centers and cloud computing. The XCV2000E-6FGG680C is also designed to be compatible with the latest network protocols and is capable of supporting the latest technologies such as virtualization and containerization.
The XCV2000E-6FGG680C is designed to be highly reliable and is capable of handling large amounts of data. The chip is designed to be compatible with the latest network protocols and is capable of supporting the latest technologies such as virtualization and containerization. It is also designed to be energy efficient and can be used in a variety of applications.
As the industry trends evolve, the XCV2000E-6FGG680C will continue to be an important component of networks and intelligent scenarios. The chip is designed to be highly reliable and is capable of handling large amounts of data. It is also designed to be energy efficient and can be used in a variety of applications.
In order to ensure the best performance and reliability of the XCV2000E-6FGG680C, it is important to understand the product description and specific design requirements. It is also important to consider the actual case studies and precautions when using the chip. It is also important to consider the possible future applications of the chip and whether it is possible to be used in the era of fully intelligent systems.
The XCV2000E-6FGG680C is a powerful and reliable component that can be used in a wide range of applications. With its advanced features and design, the chip is suitable for a variety of networks and intelligent scenarios. In order to ensure the best performance and reliability of the XCV2000E-6FGG680C, it is important to understand the product description and specific design requirements, as well as the actual case studies and precautions when using the chip. As the industry trends evolve, the XCV2000E-6FGG680C will continue to be an important component of networks and intelligent scenarios. It is also important to consider the possible future applications of the chip and whether it is possible to be used in the era of fully intelligent systems.
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5,273 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $390.6000 | $390.6000 |
| 10+ | $386.4000 | $3,864.0000 |
| 100+ | $365.4000 | $36,540.0000 |
| 1000+ | $344.4000 | $172,200.0000 |
| 10000+ | $315.0000 | $315,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||