AMD Xilinx
XCV2000E-6FGG1156C
XCV2000E-6FGG1156C ECAD Model
XCV2000E-6FGG1156C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 804 | |
| Number of Outputs | 804 | |
| Number of Logic Cells | 43200 | |
| Number of Equivalent Gates | 518400 | |
| Number of CLBs | 9600 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 9600 CLBS, 518400 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Pin Count | 1156 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV2000E-6FGG1156C Datasheet Download
XCV2000E-6FGG1156C Overview
The XCV2000E-6FGG1156C chip model is a highly advanced product that is designed to meet the ever-changing needs of the industry. This chip model has been designed to provide a robust and reliable solution to the ever-changing needs of the industry. It is a high-performance chip model that is capable of meeting the needs of a wide range of applications.
The XCV2000E-6FGG1156C chip model offers a range of features and benefits that make it an ideal choice for a wide range of applications. This chip model is designed to provide a range of features such as high speed, low power consumption, and low latency. Additionally, the chip model is designed to be able to support a wide variety of communication protocols, making it suitable for a wide range of applications.
The XCV2000E-6FGG1156C chip model is designed with the intention of providing a reliable and robust solution to the ever-changing needs of the industry. This chip model is designed to provide a wide range of features and benefits that make it an ideal choice for a wide range of applications. Additionally, this chip model is designed to be able to support a wide variety of communication protocols, making it suitable for a wide range of applications.
In terms of the industry trends of the XCV2000E-6FGG1156C chip model, it is expected that the demand for this chip model will continue to increase in the future. This is due to the fact that the chip model is designed to provide a robust and reliable solution to the ever-changing needs of the industry. Additionally, the chip model is designed to be able to support a wide variety of communication protocols, making it suitable for a wide range of applications.
In terms of the future development of the chip model, it is expected that the XCV2000E-6FGG1156C chip model will continue to be upgraded in the future. This is due to the fact that the chip model is designed to provide a robust and reliable solution to the ever-changing needs of the industry. Additionally, the chip model is designed to be able to support a wide variety of communication protocols, making it suitable for a wide range of applications.
In terms of whether the application environment requires the support of new technologies, it depends on what specific technologies are needed. The chip model is designed to be able to support a wide variety of communication protocols, making it suitable for a wide range of applications. However, if the application requires the support of new technologies, then the chip model may need to be upgraded to incorporate those technologies.
Overall, the XCV2000E-6FGG1156C chip model is a highly advanced product that is designed to meet the ever-changing needs of the industry. This chip model has been designed to provide a robust and reliable solution to the ever-changing needs of the industry. Additionally, the chip model is designed to be able to support a wide variety of communication protocols, making it suitable for a wide range of applications. The chip model is expected to continue to be upgraded in the future in order to meet the changing needs of the industry. Finally, whether the application environment requires the support of new technologies depends on what specific technologies are needed.
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