AMD Xilinx
XCV2000E-6BGG560I
XCV2000E-6BGG560I ECAD Model
XCV2000E-6BGG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 43200 | |
| Number of Equivalent Gates | 518400 | |
| Number of CLBs | 9600 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 9600 CLBS, 518400 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA560,33X33,50 | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV2000E-6BGG560I Datasheet Download
XCV2000E-6BGG560I Overview
The chip model XCV2000E-6BGG560I is a product of the semiconductor industry, and it has become increasingly popular due to its advanced features and high performance. This chip model is designed to provide an efficient and reliable platform for a variety of applications, such as communication systems, multimedia applications, and embedded systems. It is based on a 32-bit RISC architecture and is capable of operating at speeds up to 200MHz.
The XCV2000E-6BGG560I is equipped with a variety of features that make it suitable for various applications. These include a high-speed memory controller, a low-power design, and a number of peripherals such as USB, Ethernet, and UART. It also has an advanced power management system and a wide range of software development tools. The chip model is designed to be compatible with a variety of operating systems, including Linux, Windows, and Android.
The XCV2000E-6BGG560I is suitable for use in a variety of industries, such as automotive, consumer electronics, and medical devices. It can be used in a wide range of applications, including automotive infotainment systems, home automation, and industrial automation. The chip model is also suitable for use in the development and popularization of future intelligent robots, as it provides a reliable and efficient platform for the development of robotic systems.
In order to use the XCV2000E-6BGG560I effectively, certain technical skills are necessary. These include knowledge of embedded systems, programming languages, and software development tools. Additionally, it is important to have a good understanding of the industry trends and the future development of related industries, as well as an understanding of the application environment and the technologies needed to support it.
When it comes to the industry trends and the future development of related industries, the XCV2000E-6BGG560I is well suited to meet the demands of the industry. It is designed to provide an efficient and reliable platform for a variety of applications, and it is capable of operating at speeds up to 200MHz. Additionally, the chip model is designed to be compatible with a variety of operating systems, and it is equipped with a wide range of software development tools.
In conclusion, the XCV2000E-6BGG560I is a powerful and reliable chip model that is suitable for use in a variety of industries and applications. It is capable of operating at speeds up to 200MHz, and it is equipped with a wide range of software development tools. In order to use the chip model effectively, certain technical skills are necessary, such as knowledge of embedded systems, programming languages, and software development tools. Additionally, it is important to have a good understanding of the industry trends and the future development of related industries, as well as an understanding of the application environment and the technologies needed to support it.
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