XCV2000E-6BGG560C
XCV2000E-6BGG560C
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rohs

AMD Xilinx

XCV2000E-6BGG560C


XCV2000E-6BGG560C
F20-XCV2000E-6BGG560C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA, BGA560,33X33,50
LBGA, BGA560,33X33,50

XCV2000E-6BGG560C ECAD Model


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XCV2000E-6BGG560C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 404
Number of Outputs 404
Number of Logic Cells 43200
Number of Equivalent Gates 518400
Number of CLBs 9600
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 9600 CLBS, 518400 GATES
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B560
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 560
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA560,33X33,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA, BGA560,33X33,50
Pin Count 560
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV2000E-6BGG560C Datasheet Download


XCV2000E-6BGG560C Overview



The chip model XCV2000E-6BGG560C is a cutting-edge model that has been designed for a variety of applications and has become increasingly popular in the chip industry. It is a high-performance, low-power, and cost-effective device that is designed for a wide range of applications. It is capable of providing high-speed data processing, low power consumption, and a low cost of operation.


The XCV2000E-6BGG560C has been gaining popularity in the chip industry due to its superior performance and flexibility. It is capable of supporting a wide range of applications, including high-speed data processing, low power consumption, and low cost of operation. It is also capable of providing a high level of security, reliability, and scalability.


The chip model XCV2000E-6BGG560C is expected to experience increased demand in the future due to its superior performance and flexibility. It is capable of providing a wide range of applications, including high-speed data processing, low power consumption, and low cost of operation. It is also capable of providing a high level of security, reliability, and scalability. Additionally, it is expected to be used in the development and popularization of future intelligent robots, as it is capable of providing a platform for the development of sophisticated algorithms and software.


In order to use the chip model XCV2000E-6BGG560C effectively, a certain level of technical knowledge is required. This includes knowledge of programming languages, hardware design, and software development. Additionally, knowledge of artificial intelligence, machine learning, and robotics will be beneficial for those who wish to use the model effectively.


Overall, the chip model XCV2000E-6BGG560C is an advanced device that is capable of providing a wide range of applications. It is expected to experience increased demand in the future due to its superior performance and flexibility. In order to use the model effectively, a certain level of technical knowledge is needed, including knowledge of programming languages, hardware design, and software development. Additionally, knowledge of artificial intelligence, machine learning, and robotics will be beneficial for those who wish to use the model effectively.



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QTY Unit Price Ext Price
1+ $546.3344 $546.3344
10+ $540.4598 $5,404.5980
100+ $511.0870 $51,108.6981
1000+ $481.7142 $240,857.0830
10000+ $440.5922 $440,592.2250
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