AMD Xilinx
XCV200-6PQG240C
XCV200-6PQG240C ECAD Model
XCV200-6PQG240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-6PQG240C Datasheet Download
XCV200-6PQG240C Overview
The XCV200-6PQG240C chip model is a high-performance, embedded processing solution for digital signal processing, image processing, and other related applications. It is designed to provide users with the most efficient and reliable processing power in a compact form factor. The XCV200-6PQG240C chip model is built with the latest in programmable logic technology, allowing users to create and customize their own designs with HDL language.
The XCV200-6PQG240C chip model provides users with a wide range of advantages. It offers a high level of performance and reliability, as well as low power consumption. The chip model also provides users with a wide range of configurable options, allowing them to tailor the chip model to their specific needs. Additionally, the chip model is designed with a modular architecture, allowing users to easily upgrade and scale their designs as needed.
The XCV200-6PQG240C chip model is expected to become increasingly popular in the near future, as more and more industries require high-performance embedded processing solutions. The chip model is ideal for use in a wide range of applications, from consumer electronics to industrial automation. The chip model is also expected to become increasingly popular in the automotive industry, as more and more vehicles are being equipped with advanced embedded processing solutions.
The original design intention of the XCV200-6PQG240C chip model was to provide users with an efficient and reliable processing solution for their applications. The chip model was designed with a modular architecture, allowing users to easily upgrade and scale their designs as needed. Additionally, the chip model was designed with the latest in programmable logic technology, allowing users to create and customize their own designs with HDL language.
The XCV200-6PQG240C chip model is capable of being upgraded to meet the needs of future applications. The chip model can be used in advanced communication systems, as it has the necessary features and capabilities to support such systems. Additionally, the chip model is capable of supporting a wide range of applications, from consumer electronics to industrial automation.
In conclusion, the XCV200-6PQG240C chip model is an ideal solution for high-performance digital signal processing, embedded processing, image processing, and other related applications. The chip model offers users a wide range of advantages, including a high level of performance and reliability, low power consumption, and a wide range of configurable options. Additionally, the chip model is capable of supporting a wide range of applications, from consumer electronics to industrial automation, and can be upgraded to meet the needs of future applications.
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