AMD Xilinx
XCV200-6FGG456I
XCV200-6FGG456I ECAD Model
XCV200-6FGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-6FGG456I Datasheet Download
XCV200-6FGG456I Overview
The chip model XCV200-6FGG456I is a new product developed by the semiconductor industry, bringing many advantages to its users. This model is a high-performance, low-power chip that is suitable for a wide range of applications. It has a high-speed, low-power design that is suitable for modern communication systems. It also has a low-power consumption, making it ideal for applications that require a high degree of energy efficiency.
The advantages of the chip model XCV200-6FGG456I are numerous. It has a high-speed, low-power design that is suitable for modern communication systems. It also has a low-power consumption, making it ideal for applications that require a high degree of energy efficiency. Additionally, this model has a wide range of features that make it suitable for a variety of applications. It is designed to be compatible with a wide range of communication protocols and can be used for a variety of applications.
The chip model XCV200-6FGG456I is expected to be in high demand in the future due to its many advantages. It is suitable for a wide range of applications and can be used in a variety of communication systems. Additionally, its low-power consumption makes it ideal for applications that require a high degree of energy efficiency. This model is also designed to be compatible with a wide range of communication protocols, making it suitable for a variety of applications.
The chip model XCV200-6FGG456I was originally designed with the intention of being a high-performance, low-power chip that is suitable for a wide range of applications. It is designed to be compatible with a wide range of communication protocols and can be used for a variety of applications. Additionally, it has a low-power consumption, making it ideal for applications that require a high degree of energy efficiency. The model also has the potential for future upgrades and can be used for advanced communication systems.
The product description and specific design requirements of the chip model XCV200-6FGG456I are as follows. The model has a high-speed, low-power design that is suitable for modern communication systems. It is designed to be compatible with a wide range of communication protocols and can be used for a variety of applications. Additionally, it has a low-power consumption, making it ideal for applications that require a high degree of energy efficiency.
There have been a number of case studies and precautions that have been taken into consideration when designing the chip model XCV200-6FGG456I. The model has been tested extensively to ensure that it meets the required standards and that it is suitable for a variety of applications. Additionally, the model has been designed to be compatible with a wide range of communication protocols and can be used for a variety of applications.
In conclusion, the chip model XCV200-6FGG456I is a high-performance, low-power chip that is suitable for a wide range of applications. It has a high-speed, low-power design that is suitable for modern communication systems. Additionally, it has a low-power consumption, making it ideal for applications that require a high degree of energy efficiency. The model is expected to be in high demand in the future and has the potential for future upgrades. It is designed to be compatible with a wide range of communication protocols and can be used for a variety of applications. Case studies and precautions have been taken into consideration when designing the chip model, ensuring that it meets the required standards and is suitable for a variety of applications.
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3,654 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $242.8409 | $242.8409 |
| 10+ | $240.2297 | $2,402.2966 |
| 100+ | $227.1737 | $22,717.3704 |
| 1000+ | $214.1177 | $107,058.8720 |
| 10000+ | $195.8394 | $195,839.4000 |
| The price is for reference only, please refer to the actual quotation! | ||