AMD Xilinx
XCV200-6FGG256C
XCV200-6FGG256C ECAD Model
XCV200-6FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-6FGG256C Datasheet Download
XCV200-6FGG256C Overview
The XCV200-6FGG256C chip model is a powerful and versatile model designed for high-performance digital signal processing, embedded processing, image processing, and other related applications. It is a highly specialized chip model that requires the use of HDL language for programming and implementation. This chip model has several advantages that make it a great choice for various applications.
First, the XCV200-6FGG256C chip model has a high-performance architecture which allows it to process data quickly and accurately. It is also capable of handling multiple tasks simultaneously, making it an ideal choice for applications that require high-speed data processing and analysis. Additionally, the chip model is designed to be power-efficient, making it a great choice for applications that require low power consumption.
Second, the XCV200-6FGG256C chip model is designed with advanced features such as on-board memory, multiplexing, and other features that make it suitable for a wide range of applications. This chip model also has a wide range of interfaces, making it easy to integrate into existing systems. Furthermore, the chip model is designed with high-level security features, making it a reliable choice for applications that require secure data processing.
Finally, the XCV200-6FGG256C chip model is designed to be compatible with a wide range of technologies, making it a great choice for applications that require the support of new technologies. This chip model is also designed to be compatible with a wide range of programming languages, making it an ideal choice for applications that require the use of multiple programming languages.
The XCV200-6FGG256C chip model is an excellent choice for applications that require high-performance digital signal processing, embedded processing, image processing, and other related applications. Its high-performance architecture, power efficiency, advanced features, and wide range of compatibility make it a great choice for a variety of applications. As the demand for this chip model increases in the future, the XCV200-6FGG256C chip model is expected to become even more popular and widely used.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $242.8409 | $242.8409 |
| 10+ | $240.2297 | $2,402.2966 |
| 100+ | $227.1737 | $22,717.3704 |
| 1000+ | $214.1177 | $107,058.8720 |
| 10000+ | $195.8394 | $195,839.4000 |
| The price is for reference only, please refer to the actual quotation! | ||