AMD Xilinx
XCV200-6FG456I
XCV200-6FG456I ECAD Model
XCV200-6FG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 284 | |
| Number of Outputs | 284 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-6FG456I Datasheet Download
XCV200-6FG456I Overview
The chip model XCV200-6FG456I is a powerful and versatile chip designed for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a hardware description language used to program digital logic circuits. This chip is capable of handling a wide range of applications, from basic digital signal processing to more complex image processing.
The industry trends of the chip model XCV200-6FG456I are largely dependent on what specific technologies are needed. As the world moves towards more intelligent systems, the chip model XCV200-6FG456I is likely to be used in many different scenarios. In networks, the chip model XCV200-6FG456I may be used to control complex networked systems, as well as for image processing, artificial intelligence, and machine learning. It is also likely to be used in the upcoming era of fully intelligent systems, as the chip model XCV200-6FG456I is powerful enough to handle the most complex tasks.
The chip model XCV200-6FG456I is an excellent choice for a wide range of applications. With its high-performance digital signal processing, embedded processing, and image processing capabilities, it is capable of handling a wide range of tasks. As the world moves towards more intelligent systems, the chip model XCV200-6FG456I is likely to be used in many different scenarios. It is an excellent choice for networks, image processing, artificial intelligence, and machine learning, and it is likely to be used in the upcoming era of fully intelligent systems.
You May Also Be Interested In
5,575 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $242.8409 | $242.8409 |
| 10+ | $240.2297 | $2,402.2966 |
| 100+ | $227.1737 | $22,717.3704 |
| 1000+ | $214.1177 | $107,058.8720 |
| 10000+ | $195.8394 | $195,839.4000 |
| The price is for reference only, please refer to the actual quotation! | ||