AMD Xilinx
XCV200-6BGG352I
XCV200-6BGG352I ECAD Model
XCV200-6BGG352I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 352 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-6BGG352I Datasheet Download
XCV200-6BGG352I Overview
The XCV200-6BGG352I chip model is a high-performance, multi-functional chip designed to meet the needs of digital signal processing, embedded processing, and image processing. It is designed to be programmed in HDL language and is suitable for a wide range of applications, including high-end communication systems.
The XCV200-6BGG352I chip model is designed to be highly scalable and can be easily upgraded to meet changing needs. It is designed to be able to handle complex signal processing tasks and is capable of delivering high-performance results. It can also be used for advanced communication systems, as it is designed to be compatible with the latest communication protocols.
In terms of industry trends, the XCV200-6BGG352I chip model is designed to be able to handle the latest technologies, such as 5G, AI, and IoT. This allows for faster and more efficient communication, as well as better image processing capabilities. Additionally, the chip is designed to be able to handle new technologies as they become available, allowing for future upgrades.
The original design intention of the XCV200-6BGG352I chip model was to provide a high-performance, multi-functional chip that could be used for a wide range of applications. It is designed to be able to handle complex signal processing tasks, as well as advanced communication systems. Additionally, it is designed to be highly scalable and able to handle the latest technologies as they become available. This makes it an ideal choice for a wide range of applications, including high-end communication systems.
You May Also Be Interested In
5,003 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $205.3202 | $205.3202 |
| 10+ | $203.1124 | $2,031.1245 |
| 100+ | $192.0737 | $19,207.3728 |
| 1000+ | $181.0350 | $90,517.5040 |
| 10000+ | $165.5808 | $165,580.8000 |
| The price is for reference only, please refer to the actual quotation! | ||