AMD Xilinx
XCV200-6BG352I
XCV200-6BG352I ECAD Model
XCV200-6BG352I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 260 | |
| Number of Outputs | 260 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-6BG352I Datasheet Download
XCV200-6BG352I Overview
The XCV200-6BG352I chip model is a high-end, advanced model that offers a range of excellent features and capabilities. It is designed to meet the needs of the most demanding applications, and its design intention is to provide a reliable and efficient solution to a variety of industries.
The XCV200-6BG352I chip model offers a number of advantages over other chip models. It is capable of supporting multiple operating systems, and has a high level of performance and scalability. It also has a low power consumption and is highly reliable. In addition, it has a wide range of features, such as a high-speed data transfer rate, support for multiple processors, and a high level of security.
The XCV200-6BG352I chip model is expected to be in high demand in the coming years, as it is suitable for a wide range of industries, such as automotive, industrial, medical, and aerospace. Its high-end performance and scalability make it ideal for applications that require a reliable, efficient solution. It is also expected to be in high demand in the communications industry, as it is capable of supporting advanced communication systems.
The XCV200-6BG352I chip model is also expected to be a key component in the development and popularization of future intelligent robots. Its scalability and features make it an ideal choice for robotics applications. It is also expected to be used in a wide range of other applications, such as computer vision, machine learning, and artificial intelligence.
In order to use the XCV200-6BG352I chip model effectively, it is important to have a strong understanding of the chip's capabilities and features. It is also important to have a good understanding of the different types of software and hardware that are required for its use. Technical talents such as software engineers, hardware engineers, and system architects are needed in order to use the chip model effectively.
The XCV200-6BG352I chip model is an advanced, high-end model that offers a range of excellent features and capabilities. It is expected to be in high demand in a variety of industries, and is also expected to be a key component in the development and popularization of future intelligent robots. In order to use the chip model effectively, it is important to have a strong understanding of the chip's capabilities and features, as well as the different types of software and hardware that are required for its use. Technical talents such as software engineers, hardware engineers, and system architects are needed in order to use the chip model effectively.
You May Also Be Interested In
3,217 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $205.3202 | $205.3202 |
| 10+ | $203.1124 | $2,031.1245 |
| 100+ | $192.0737 | $19,207.3728 |
| 1000+ | $181.0350 | $90,517.5040 |
| 10000+ | $165.5808 | $165,580.8000 |
| The price is for reference only, please refer to the actual quotation! | ||