AMD Xilinx
XCV200-5PQG240C
XCV200-5PQG240C ECAD Model
XCV200-5PQG240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-5PQG240C Datasheet Download
XCV200-5PQG240C Overview
The chip model XCV200-5PQG240C is a cutting-edge semiconductor technology developed by leading chip manufacturer Xilinx. It is designed to provide a powerful, low-power, and cost-effective solution for a wide range of applications. The chip model is based on the Xilinx Virtex-5 FPGA family, which is the most advanced FPGA technology available. This chip model is capable of supporting a wide range of applications, including high-speed communications, data processing, and embedded systems.
The chip model XCV200-5PQG240C offers several advantages over competing products. It is designed to be highly efficient, with a maximum power consumption of only 3.5 W, and it is capable of supporting a wide range of applications with its advanced features. It is also designed to be highly reliable, with an estimated mean time between failures (MTBF) of up to 5 million hours. Additionally, the chip model is designed to be highly flexible, with the ability to be easily upgraded with new features and technologies.
The chip model XCV200-5PQG240C is expected to have strong demand in the future. As the demand for high-speed communications and data processing increases, the chip model is expected to be in high demand. Additionally, the chip model is expected to be used in a variety of applications, including embedded systems, automotive systems, and medical devices.
The original design intention of the chip model XCV200-5PQG240C was to provide a powerful, low-power, and cost-effective solution for a wide range of applications. The chip model has been designed to be highly reliable and efficient, and it is capable of supporting a wide range of applications. Additionally, the chip model is designed to be highly flexible, with the ability to be easily upgraded with new features and technologies.
The chip model XCV200-5PQG240C is expected to be able to support advanced communication systems in the future. The chip model is designed to be highly efficient and reliable, and it is capable of supporting a wide range of applications. Additionally, the chip model is designed to be highly flexible, with the ability to be easily upgraded with new features and technologies. As the demand for high-speed communications and data processing increases, the chip model is expected to be able to support advanced communication systems in the future.
Overall, the chip model XCV200-5PQG240C offers several advantages over competing products. It is designed to be highly efficient and reliable, and it is capable of supporting a wide range of applications. Additionally, the chip model is designed to be highly flexible, with the ability to be easily upgraded with new features and technologies. As the demand for high-speed communications and data processing increases, the chip model is expected to be in high demand in the future, and it is expected to be able to support advanced communication systems.
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