AMD Xilinx
XCV200-5FGG456I
XCV200-5FGG456I ECAD Model
XCV200-5FGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-5FGG456I Datasheet Download
XCV200-5FGG456I Overview
The XCV200-5FGG456I chip model is a powerful and versatile device designed for use in a variety of applications. It is designed to meet the needs of modern communication systems, including the most advanced and demanding applications. The XCV200-5FGG456I chip model is equipped with a wide range of features and capabilities that make it an ideal choice for applications such as wireless networks, high-speed data transfer, and other cutting-edge communication systems.
The original design intention of the XCV200-5FGG456I chip model was to provide a reliable and cost-effective solution for modern communication systems. The chip model was designed with a focus on flexibility, scalability, and performance. It is capable of supporting a wide range of applications and can be used in a variety of scenarios. The chip model can be used in both wired and wireless networks, as well as in a variety of other advanced communication systems.
The XCV200-5FGG456I chip model is also designed with the potential for future upgrades in mind. It is designed to be able to handle the ever-evolving demands of modern communication systems. The chip model is equipped with the latest technology, including advanced signal processing and data encryption capabilities. It is also designed with the capability to be upgraded in the future, allowing it to keep up with the changing demands of communication systems.
The XCV200-5FGG456I chip model is capable of being applied to a variety of intelligent scenarios. It can be used in networks that require high levels of security and reliability, as well as in networks that require advanced processing capabilities. It can also be used in the era of fully intelligent systems, where the chip model can provide the necessary processing power and data encryption capabilities to support the most advanced communication systems.
In terms of product description and specific design requirements, the XCV200-5FGG456I chip model is equipped with a wide range of features and capabilities. It is designed to be compatible with a variety of communication systems, including wireless networks, high-speed data transfer, and other advanced communication systems. The chip model is also designed with the potential for future upgrades in mind, allowing it to keep up with the ever-evolving demands of modern communication systems.
The XCV200-5FGG456I chip model is also designed with a focus on reliability and performance. It is equipped with the latest technology, including advanced signal processing and data encryption capabilities. The chip model is also designed with the capability to be upgraded in the future, allowing it to keep up with the changing demands of communication systems.
To ensure the success of the XCV200-5FGG456I chip model, it is important to consider actual case studies and precautions. It is important to consider the particular requirements of the application and the environment in which the chip model will be used. It is also important to consider the potential for future upgrades and the capabilities of the chip model in the era of fully intelligent systems.
Overall, the XCV200-5FGG456I chip model is a powerful and versatile device designed for use in a variety of applications. It is designed with the potential for future upgrades in mind, allowing it to keep up with the ever-evolving demands of modern communication systems. It can be applied to a variety of intelligent scenarios, as well as in the era of fully intelligent systems. It is important to consider actual case studies and precautions to ensure the success of the XCV200-5FGG456I chip model.
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