AMD Xilinx
XCV200-5FGG256I
XCV200-5FGG256I ECAD Model
XCV200-5FGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-5FGG256I Datasheet Download
XCV200-5FGG256I Overview
The XCV200-5FGG256I chip model is an innovative development in the field of microelectronics. This chip model is designed to provide a high level of performance, flexibility, and scalability while reducing the overall cost of development. The model is capable of providing a wide range of features and functions, including high-speed data transmission, low-power operation, and advanced communication systems.
The original design intention of the XCV200-5FGG256I chip model was to provide a cost-effective solution for the development of advanced communication systems. The model is designed to provide the necessary features and functions to enable the development of new systems, such as high-speed data transmission, low-power operation, and advanced communication systems. The model is also designed to be highly scalable and flexible, allowing for future upgrades and enhancements.
The product description of the XCV200-5FGG256I chip model includes a range of features and functions, including high-speed data transmission, low-power operation, and advanced communication systems. The model also includes a range of security features, such as authentication, encryption, and data integrity. In addition, the model includes a range of hardware and software features, such as a low-power core, a high-speed memory interface, and an integrated development environment.
The actual case studies and precautions of the XCV200-5FGG256I chip model are designed to ensure that the model is used in a safe and secure manner. The model should be used in accordance with the manufacturer’s instructions and should be tested for compatibility with other hardware and software components. In addition, the model should be used in accordance with the applicable safety and security guidelines.
The XCV200-5FGG256I chip model can be applied to the development and popularization of future intelligent robots. The model is designed to provide the necessary features and functions to enable the development of new systems, such as high-speed data transmission, low-power operation, and advanced communication systems. In addition, the model can be used to enable the development of advanced artificial intelligence systems, such as autonomous navigation and decision-making.
In order to use the XCV200-5FGG256I chip model effectively, certain technical talents are required. These include knowledge of microelectronics, programming, and computer engineering. In addition, knowledge of artificial intelligence, robotics, and machine learning is also beneficial. Furthermore, knowledge of safety and security protocols is also necessary in order to ensure the safe and secure use of the model.
In conclusion, the XCV200-5FGG256I chip model is an innovative development in the field of microelectronics. The model is designed to provide a high level of performance, flexibility, and scalability while reducing the overall cost of development. The model can be used to enable the development of advanced communication systems, as well as to enable the development of future intelligent robots. In order to use the model effectively, certain technical talents are required, such as knowledge of microelectronics, programming, and computer engineering.
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