AMD Xilinx
XCV200-5FGG256C
XCV200-5FGG256C ECAD Model
XCV200-5FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-5FGG256C Datasheet Download
XCV200-5FGG256C Overview
The XCV200-5FGG256C chip model is a high-performance, low-power integrated circuit (IC) specifically designed to meet the needs of digital signal processing, embedded processing, and image processing applications. It is an ideal choice for those who require a high-performance and reliable device.
The XCV200-5FGG256C chip model was designed with an intention to provide an efficient and cost-effective solution for all types of digital signal processing, embedded processing, and image processing applications. Its flexible design allows for future upgrades, making it an ideal choice for those looking for a long-term solution. In addition, the chip model can be used for advanced communication systems, allowing for the development and implementation of more complex and reliable technologies.
The XCV200-5FGG256C chip model is also suitable for the development and popularization of future intelligent robots. Its high-speed processing capabilities and low-power consumption make it an ideal choice for those who are looking for a reliable and efficient robotic platform. To use the model effectively, it requires the use of HDL language and a certain level of technical expertise.
Overall, the XCV200-5FGG256C chip model is a great choice for those who require a reliable and efficient solution for digital signal processing, embedded processing, image processing, and advanced communication systems. Its flexible design allows for future upgrades and its low-power consumption makes it suitable for the development and popularization of future intelligent robots. Those looking to use the model effectively will need to have a good understanding of HDL language and possess the necessary technical expertise.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||