AMD Xilinx
XCV200-5BGG352I
XCV200-5BGG352I ECAD Model
XCV200-5BGG352I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 352 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-5BGG352I Datasheet Download
XCV200-5BGG352I Overview
The XCV200-5BGG352I chip model is a revolutionary technology designed to revolutionize the way we interact with the world around us. Developed by a leading semiconductor manufacturer, the XCV200-5BGG352I model offers a wide range of features and capabilities that make it an ideal choice for a variety of industries.
The XCV200-5BGG352I chip model features a 32-bit RISC processor, which enables it to process data quickly and efficiently. This makes it an ideal choice for applications that require high levels of performance, such as advanced communication systems, intelligent robots, and other complex tasks. It also features a wide range of memory and I/O options, allowing users to configure the chip model to their specific needs.
The XCV200-5BGG352I chip model also has a number of advantages over other models. It is capable of operating at higher frequencies, which allows it to process data faster. It also has a low power consumption, which makes it an ideal choice for applications that require energy efficiency. Finally, it is highly reliable, with a long life expectancy and a low failure rate.
The XCV200-5BGG352I chip model is expected to be in high demand in the coming years. This is due to its wide range of features and capabilities, as well as its ability to support the development and popularization of future intelligent robots and other advanced communication systems. This chip model also has the potential to be upgraded in the future, allowing users to take advantage of the latest technologies and features.
In order to use the XCV200-5BGG352I chip model effectively, users will need to have a good understanding of the chip model's capabilities and features. They will also need to have a basic understanding of programming and electronics, as well as the ability to troubleshoot and debug any issues that may arise. Additionally, users should be familiar with the latest technologies in the field of robotics and communication systems, as this will help them to make the most of the XCV200-5BGG352I chip model.
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