AMD Xilinx
XCV200-5BGG352C
XCV200-5BGG352C ECAD Model
XCV200-5BGG352C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 352 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-5BGG352C Datasheet Download
XCV200-5BGG352C Overview
The XCV200-5BGG352C chip model is a high-performance digital signal processor that is suitable for a wide range of applications, such as embedded processing, image processing, and more. It is designed to be used with the HDL language, providing an efficient and reliable platform for advanced communication systems.
The XCV200-5BGG352C chip model was designed with the intention of providing a high-performance processor that is capable of meeting the needs of modern networks. It is designed to be able to easily upgrade and expand, making it an ideal choice for more advanced communication systems. The chip model is also capable of being used in a variety of intelligent scenarios, such as machine learning, artificial intelligence, and more.
The XCV200-5BGG352C chip model is an ideal choice for the future of intelligent systems. It is designed to be able to handle complex tasks with ease, making it a great choice for networks that require a reliable and powerful processor. The chip model is also capable of being used in a variety of intelligent scenarios, such as natural language processing, facial recognition, and more.
In summary, the XCV200-5BGG352C chip model is a powerful and reliable processor that is suitable for a wide range of applications. It is designed to be used with the HDL language, providing an efficient and reliable platform for advanced communication systems. The chip model is also capable of being used in a variety of intelligent scenarios, making it an ideal choice for the future of intelligent systems.
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3,774 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $382.7880 | $382.7880 |
| 10+ | $378.6720 | $3,786.7200 |
| 100+ | $358.0920 | $35,809.2000 |
| 1000+ | $337.5120 | $168,756.0000 |
| 10000+ | $308.7000 | $308,700.0000 |
| The price is for reference only, please refer to the actual quotation! | ||