XCV200-5BGG256I
XCV200-5BGG256I
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rohs

AMD Xilinx

XCV200-5BGG256I


XCV200-5BGG256I
F20-XCV200-5BGG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV200-5BGG256I ECAD Model


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XCV200-5BGG256I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 236666
Number of CLBs 1176
Combinatorial Delay of a CLB-Max 700 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1176 CLBS, 236666 GATES
Clock Frequency-Max 294 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 256
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV200-5BGG256I Datasheet Download


XCV200-5BGG256I Overview



The XCV200-5BGG256I chip model is a powerful and versatile processor, designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. This chip model is programmed using the HDL language, which is a hardware description language that enables the efficient design of digital circuits and systems.


The XCV200-5BGG256I chip model is capable of delivering high-performance processing for a wide range of applications. It offers a number of advantages, such as low power consumption, high-speed operation, and low cost. This chip model is also highly scalable, meaning that it can be easily adapted to the needs of different applications.


The XCV200-5BGG256I chip model is expected to be in high demand in the coming years, as more and more applications require high-performance processing. The chip model is likely to be used in a wide range of industries, such as automotive, aerospace, and medical. It is also likely to be used in networks, as it is capable of delivering high-speed data processing.


Furthermore, the XCV200-5BGG256I chip model is likely to be used in a number of intelligent scenarios. It is capable of performing complex tasks quickly and efficiently, making it an ideal choice for applications such as self-driving cars and robotics. As the world moves towards a fully intelligent future, this chip model is likely to be in high demand, as it is capable of delivering the performance needed for these intelligent applications.



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Unit Price: $78.72
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QTY Unit Price Ext Price
1+ $73.2096 $73.2096
10+ $72.4224 $724.2240
100+ $68.4864 $6,848.6400
1000+ $64.5504 $32,275.2000
10000+ $59.0400 $59,040.0000
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