
AMD Xilinx
XCV200-5BGG256I
XCV200-5BGG256I ECAD Model
XCV200-5BGG256I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 236666 | |
Number of CLBs | 1176 | |
Combinatorial Delay of a CLB-Max | 700 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1176 CLBS, 236666 GATES | |
Clock Frequency-Max | 294 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.55 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV200-5BGG256I Datasheet Download
XCV200-5BGG256I Overview
The XCV200-5BGG256I chip model is a powerful and versatile processor, designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. This chip model is programmed using the HDL language, which is a hardware description language that enables the efficient design of digital circuits and systems.
The XCV200-5BGG256I chip model is capable of delivering high-performance processing for a wide range of applications. It offers a number of advantages, such as low power consumption, high-speed operation, and low cost. This chip model is also highly scalable, meaning that it can be easily adapted to the needs of different applications.
The XCV200-5BGG256I chip model is expected to be in high demand in the coming years, as more and more applications require high-performance processing. The chip model is likely to be used in a wide range of industries, such as automotive, aerospace, and medical. It is also likely to be used in networks, as it is capable of delivering high-speed data processing.
Furthermore, the XCV200-5BGG256I chip model is likely to be used in a number of intelligent scenarios. It is capable of performing complex tasks quickly and efficiently, making it an ideal choice for applications such as self-driving cars and robotics. As the world moves towards a fully intelligent future, this chip model is likely to be in high demand, as it is capable of delivering the performance needed for these intelligent applications.
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Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $73.2096 | $73.2096 |
10+ | $72.4224 | $724.2240 |
100+ | $68.4864 | $6,848.6400 |
1000+ | $64.5504 | $32,275.2000 |
10000+ | $59.0400 | $59,040.0000 |
The price is for reference only, please refer to the actual quotation! |