AMD Xilinx
XCV200-5BGG256C
XCV200-5BGG256C ECAD Model
XCV200-5BGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-5BGG256C Datasheet Download
XCV200-5BGG256C Overview
The XCV200-5BGG256C chip model is a powerful tool for advanced communication systems. Developed by the renowned chip manufacturer Xilinx, the XCV200-5BGG256C is a highly reliable and energy-efficient chip model that can be used for a variety of applications. It is designed to provide high performance, low power consumption, and robustness in a single package.
The XCV200-5BGG256C chip model is designed to provide a wide range of features for a variety of applications. It is designed to support a variety of communication protocols, including Ethernet, Wi-Fi, and Bluetooth. It also supports multiple advanced communication protocols such as 3G, 4G, and 5G. The chip model also supports high-speed data transmission, making it suitable for a variety of applications, including high-speed data transmission and wireless communication.
The XCV200-5BGG256C chip model is also designed to be upgradeable, allowing users to easily upgrade the chip model to keep up with the latest technologies. This makes the chip model suitable for use in the era of fully intelligent systems, as users can easily upgrade the chip model to keep up with the latest technologies.
The XCV200-5BGG256C chip model is also suitable for use in networks and intelligent scenarios. It is designed to support a variety of networking protocols and intelligent scenarios, including the Internet of Things (IoT), Machine Learning (ML), and Artificial Intelligence (AI). It is also suitable for use in the development and popularization of future intelligent robots, as it is designed to support a variety of intelligent scenarios.
In order to effectively use the XCV200-5BGG256C chip model, technical talents are required. It is recommended that users have a good understanding of the chip model, as well as experience in programming and debugging in order to effectively use the chip model. It is also recommended that users have experience in networking and intelligent scenarios, as this will help them to effectively use the chip model.
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1,129 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $73.2096 | $73.2096 |
| 10+ | $72.4224 | $724.2240 |
| 100+ | $68.4864 | $6,848.6400 |
| 1000+ | $64.5504 | $32,275.2000 |
| 10000+ | $59.0400 | $59,040.0000 |
| The price is for reference only, please refer to the actual quotation! | ||