
AMD Xilinx
XCV200-4PQG240I
XCV200-4PQG240I ECAD Model
XCV200-4PQG240I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 236666 | |
Number of CLBs | 1176 | |
Combinatorial Delay of a CLB-Max | 800 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1176 CLBS, 236666 GATES | |
Clock Frequency-Max | 250 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PQFP-G240 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 240 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 32 mm | |
Length | 32 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | FQFP, | |
Pin Count | 240 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV200-4PQG240I Datasheet Download
XCV200-4PQG240I Overview
The chip model XCV200-4PQG240I is a powerful and versatile device that is well-suited for a variety of high-performance digital signal processing, embedded processing, and image processing applications. It is designed to meet the needs of engineers and designers who require an efficient and reliable solution for their projects. The device is programmed in HDL (Hardware Description Language), making it easy to use and highly customizable.
The XCV200-4PQG240I chip model is an excellent choice for applications that require high-performance solutions. It is capable of performing complex tasks quickly and accurately, making it suitable for a wide range of applications. Furthermore, the chip model is highly reliable and offers excellent performance even in challenging conditions.
In terms of industry trends, the XCV200-4PQG240I chip model is well-positioned to take advantage of the increasing demand for more powerful and sophisticated solutions. As technology advances, so too do the applications that the chip model can support. This means that the chip model can continue to be used in a wide variety of applications, as well as in more specialized applications that require more advanced technologies.
In terms of product description, the XCV200-4PQG240I chip model is designed to provide high-performance, low-power solutions for a variety of applications. It is capable of executing complex tasks quickly and accurately, making it suitable for a wide range of applications. Additionally, the device is designed to be highly reliable and to offer excellent performance even in challenging conditions.
In terms of design requirements, the XCV200-4PQG240I chip model is designed to meet the needs of engineers and designers who require an efficient and reliable solution for their projects. It is capable of executing complex tasks quickly and accurately, making it suitable for a wide range of applications. Additionally, the device is designed to be highly reliable and to offer excellent performance even in challenging conditions.
Finally, when it comes to actual case studies and precautions, the XCV200-4PQG240I chip model is an excellent choice for applications that require high-performance solutions. In order to ensure that the device is used correctly and safely, it is important to understand the device’s capabilities and limitations. Additionally, it is important to consider any potential risks and ensure that the device is used in accordance with the manufacturer’s instructions. By doing so, engineers and designers can ensure that the XCV200-4PQG240I chip model is used effectively and safely.
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