XCV200-4PQG240I
XCV200-4PQG240I
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rohs

AMD Xilinx

XCV200-4PQG240I


XCV200-4PQG240I
F20-XCV200-4PQG240I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FQFP
FQFP

XCV200-4PQG240I ECAD Model


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XCV200-4PQG240I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 236666
Number of CLBs 1176
Combinatorial Delay of a CLB-Max 800 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1176 CLBS, 236666 GATES
Clock Frequency-Max 250 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PQFP-G240
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 240
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Surface Mount YES
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 32 mm
Length 32 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description FQFP,
Pin Count 240
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV200-4PQG240I Datasheet Download


XCV200-4PQG240I Overview



The chip model XCV200-4PQG240I is a powerful and versatile device that is well-suited for a variety of high-performance digital signal processing, embedded processing, and image processing applications. It is designed to meet the needs of engineers and designers who require an efficient and reliable solution for their projects. The device is programmed in HDL (Hardware Description Language), making it easy to use and highly customizable.


The XCV200-4PQG240I chip model is an excellent choice for applications that require high-performance solutions. It is capable of performing complex tasks quickly and accurately, making it suitable for a wide range of applications. Furthermore, the chip model is highly reliable and offers excellent performance even in challenging conditions.


In terms of industry trends, the XCV200-4PQG240I chip model is well-positioned to take advantage of the increasing demand for more powerful and sophisticated solutions. As technology advances, so too do the applications that the chip model can support. This means that the chip model can continue to be used in a wide variety of applications, as well as in more specialized applications that require more advanced technologies.


In terms of product description, the XCV200-4PQG240I chip model is designed to provide high-performance, low-power solutions for a variety of applications. It is capable of executing complex tasks quickly and accurately, making it suitable for a wide range of applications. Additionally, the device is designed to be highly reliable and to offer excellent performance even in challenging conditions.


In terms of design requirements, the XCV200-4PQG240I chip model is designed to meet the needs of engineers and designers who require an efficient and reliable solution for their projects. It is capable of executing complex tasks quickly and accurately, making it suitable for a wide range of applications. Additionally, the device is designed to be highly reliable and to offer excellent performance even in challenging conditions.


Finally, when it comes to actual case studies and precautions, the XCV200-4PQG240I chip model is an excellent choice for applications that require high-performance solutions. In order to ensure that the device is used correctly and safely, it is important to understand the device’s capabilities and limitations. Additionally, it is important to consider any potential risks and ensure that the device is used in accordance with the manufacturer’s instructions. By doing so, engineers and designers can ensure that the XCV200-4PQG240I chip model is used effectively and safely.



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