AMD Xilinx
XCV200-4FGG456I
XCV200-4FGG456I ECAD Model
XCV200-4FGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-4FGG456I Datasheet Download
XCV200-4FGG456I Overview
The chip model XCV200-4FGG456I is a high-performance digital signal processing, embedded processing, and image processing chip that is suitable for a variety of applications. It is designed to be used with the HDL language, which is a hardware description language used to create and design digital circuits. This chip is designed to provide superior performance and accuracy for digital signal processing, embedded processing, and image processing applications.
The chip model XCV200-4FGG456I is designed to be used in a variety of industries, including automotive, consumer electronics, medical, and industrial automation. This chip model is designed to be used in high-performance applications, such as real-time data processing, machine vision, and advanced robotics. It is designed to be used in applications that require high-speed and reliable operation, such as video streaming, high-speed data transfer, and 3D imaging.
The chip model XCV200-4FGG456I is designed to be used with the latest technologies and industry trends. It is designed to be used with the latest technologies, such as FPGA, ASIC, and CPLD. It is also designed to be used with the latest industry trends, such as the Internet of Things (IoT), artificial intelligence (AI), and machine learning (ML).
The product description of the chip model XCV200-4FGG456I includes the design requirements, actual case studies, and precautions. The design requirements include the necessary components and functions, as well as the desired performance and accuracy. The actual case studies provide examples of how the chip model XCV200-4FGG456I has been used in various applications and industries. The precautions provide guidance on how to use the chip model safely and effectively.
The chip model XCV200-4FGG456I is designed to be used in a variety of applications and industries. It is designed to be used with the latest technologies and industry trends. It is designed to provide superior performance and accuracy for digital signal processing, embedded processing, and image processing applications. The product description of the chip model XCV200-4FGG456I includes the design requirements, actual case studies, and precautions to ensure safe and effective usage.
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