AMD Xilinx
XCV200-4FGG256I
XCV200-4FGG256I ECAD Model
XCV200-4FGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-4FGG256I Datasheet Download
XCV200-4FGG256I Overview
The chip model XCV200-4FGG256I is a cutting-edge technology that is revolutionizing the industry. It is a highly advanced and powerful chip model that has been developed to meet the needs of the modern world. It is designed to provide users with a reliable, efficient, and secure platform for their applications.
The XCV200-4FGG256I chip model is equipped with a wide range of features that make it suitable for a variety of applications. It is capable of handling multiple tasks at once, has a low power consumption rate, and is equipped with advanced security features. This makes it a great choice for applications that require a high level of security and performance.
The XCV200-4FGG256I chip model is also designed to be compatible with a variety of operating systems, making it suitable for a wide range of devices. This makes it an ideal choice for applications that require a high level of compatibility and scalability. In addition, the chip model is designed to be highly efficient, making it a great choice for applications that require a low power consumption rate.
The XCV200-4FGG256I chip model is expected to be in high demand in the future. It is expected to be used in a wide range of applications, including networks, intelligent systems, and fully intelligent systems. The chip model is expected to be used in a variety of intelligent scenarios, such as edge computing, machine learning, and artificial intelligence. It is also expected to be used in a variety of applications in the era of fully intelligent systems, such as autonomous vehicles and intelligent homes.
The XCV200-4FGG256I chip model is a powerful and versatile technology that is expected to revolutionize the industry. It is designed to provide users with a reliable, efficient, and secure platform for their applications. It is also designed to be compatible with a variety of operating systems, making it suitable for a wide range of devices. The chip model is expected to be in high demand in the future and is expected to be used in a variety of applications, including networks, intelligent systems, and fully intelligent systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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