XCV200-4FGG256C
XCV200-4FGG256C
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rohs

AMD Xilinx

XCV200-4FGG256C


XCV200-4FGG256C
F20-XCV200-4FGG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV200-4FGG256C ECAD Model


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XCV200-4FGG256C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 236666
Number of CLBs 1176
Combinatorial Delay of a CLB-Max 800 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1176 CLBS, 236666 GATES
Clock Frequency-Max 250 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 256
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV200-4FGG256C Datasheet Download


XCV200-4FGG256C Overview



The chip model XCV200-4FGG256C is a high-performance, low-power integrated circuit designed for a variety of applications. It is a multi-core processor with a 256-bit architecture, which provides excellent performance and power efficiency. The chip model XCV200-4FGG256C is suitable for a variety of applications, including embedded systems, network infrastructure, and Internet of Things (IoT) applications.


The XCV200-4FGG256C chip model provides a number of advantages over other chip models. It is designed with a low-power and high-performance architecture, which reduces power usage while still providing excellent performance. Additionally, the chip model has a small form factor and can be integrated into a wide variety of products. This makes it an ideal choice for applications that require a small size and low power consumption.


The demand for the XCV200-4FGG256C chip model is expected to increase in the future as more products and applications require its features. As the Internet of Things (IoT) expands, the need for low-power and high-performance chips will increase. Additionally, the chip model is suitable for a variety of embedded systems, network infrastructure, and other applications, which will further increase its demand.


The XCV200-4FGG256C chip model can be used in a variety of intelligent networks and scenarios. It is capable of providing the necessary performance and power efficiency needed for intelligent networks. Additionally, the chip model is suitable for use in the era of fully intelligent systems, as it is designed for low power consumption and high performance.


The XCV200-4FGG256C chip model has a number of specific design requirements. It is designed with a 256-bit architecture, which provides excellent performance and power efficiency. Additionally, the chip model has a small form factor and can be integrated into a wide variety of products. This makes it an ideal choice for applications that require a small size and low power consumption.


There are a number of case studies and precautions that should be taken when using the XCV200-4FGG256C chip model. It is important to ensure that the chip model is properly integrated into the system and that all of the design requirements are met. Additionally, it is important to ensure that the chip model is properly tested and that any potential issues are addressed before the product is released.


In conclusion, the XCV200-4FGG256C chip model is a high-performance, low-power integrated circuit designed for a variety of applications. It is a multi-core processor with a 256-bit architecture, which provides excellent performance and power efficiency. The chip model is suitable for a variety of applications, including embedded systems, network infrastructure, and Internet of Things (IoT) applications. The demand for the XCV200-4FGG256C chip model is expected to increase in the future as more products and applications require its features. Additionally, the chip model can be used in a variety of intelligent networks and scenarios and is suitable for use in the era of fully intelligent systems. It is important to ensure that the chip model is properly integrated into the system and that all of the design requirements are met, as well as properly tested before the product is released.



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QTY Unit Price Ext Price
1+ $163.9185 $163.9185
10+ $162.1559 $1,621.5589
100+ $153.3431 $15,334.3068
1000+ $144.5302 $72,265.1240
10000+ $132.1923 $132,192.3000
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