
AMD Xilinx
XCV200-4FGG256C
XCV200-4FGG256C ECAD Model
XCV200-4FGG256C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 236666 | |
Number of CLBs | 1176 | |
Combinatorial Delay of a CLB-Max | 800 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1176 CLBS, 236666 GATES | |
Clock Frequency-Max | 250 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV200-4FGG256C Datasheet Download
XCV200-4FGG256C Overview
The chip model XCV200-4FGG256C is a high-performance, low-power integrated circuit designed for a variety of applications. It is a multi-core processor with a 256-bit architecture, which provides excellent performance and power efficiency. The chip model XCV200-4FGG256C is suitable for a variety of applications, including embedded systems, network infrastructure, and Internet of Things (IoT) applications.
The XCV200-4FGG256C chip model provides a number of advantages over other chip models. It is designed with a low-power and high-performance architecture, which reduces power usage while still providing excellent performance. Additionally, the chip model has a small form factor and can be integrated into a wide variety of products. This makes it an ideal choice for applications that require a small size and low power consumption.
The demand for the XCV200-4FGG256C chip model is expected to increase in the future as more products and applications require its features. As the Internet of Things (IoT) expands, the need for low-power and high-performance chips will increase. Additionally, the chip model is suitable for a variety of embedded systems, network infrastructure, and other applications, which will further increase its demand.
The XCV200-4FGG256C chip model can be used in a variety of intelligent networks and scenarios. It is capable of providing the necessary performance and power efficiency needed for intelligent networks. Additionally, the chip model is suitable for use in the era of fully intelligent systems, as it is designed for low power consumption and high performance.
The XCV200-4FGG256C chip model has a number of specific design requirements. It is designed with a 256-bit architecture, which provides excellent performance and power efficiency. Additionally, the chip model has a small form factor and can be integrated into a wide variety of products. This makes it an ideal choice for applications that require a small size and low power consumption.
There are a number of case studies and precautions that should be taken when using the XCV200-4FGG256C chip model. It is important to ensure that the chip model is properly integrated into the system and that all of the design requirements are met. Additionally, it is important to ensure that the chip model is properly tested and that any potential issues are addressed before the product is released.
In conclusion, the XCV200-4FGG256C chip model is a high-performance, low-power integrated circuit designed for a variety of applications. It is a multi-core processor with a 256-bit architecture, which provides excellent performance and power efficiency. The chip model is suitable for a variety of applications, including embedded systems, network infrastructure, and Internet of Things (IoT) applications. The demand for the XCV200-4FGG256C chip model is expected to increase in the future as more products and applications require its features. Additionally, the chip model can be used in a variety of intelligent networks and scenarios and is suitable for use in the era of fully intelligent systems. It is important to ensure that the chip model is properly integrated into the system and that all of the design requirements are met, as well as properly tested before the product is released.
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5,507 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $163.9185 | $163.9185 |
10+ | $162.1559 | $1,621.5589 |
100+ | $153.3431 | $15,334.3068 |
1000+ | $144.5302 | $72,265.1240 |
10000+ | $132.1923 | $132,192.3000 |
The price is for reference only, please refer to the actual quotation! |