
AMD Xilinx
XCV200-4BGG352C
XCV200-4BGG352C ECAD Model
XCV200-4BGG352C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 236666 | |
Number of CLBs | 1176 | |
Combinatorial Delay of a CLB-Max | 800 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1176 CLBS, 236666 GATES | |
Clock Frequency-Max | 250 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B352 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 352 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 352 |
XCV200-4BGG352C Datasheet Download
XCV200-4BGG352C Overview
The XCV200-4BGG352C chip model is a high-performance digital signal processor, embedded processor, and image processor, and is designed to be used in the HDL language. It is a powerful tool that can be used to tackle complex tasks, allowing users to develop efficient and reliable systems.
This chip model has seen its applications expand over time, and is now being used in a variety of industries, such as automotive, aerospace, and medical. It has also been used in a variety of applications, such as machine learning, artificial intelligence, and robotics.
The chip model has the potential to be used in a variety of networks, and can be used to create intelligent scenarios. For instance, it can be used to develop autonomous vehicles, intelligent robots, and smart home systems. The chip model can also be used in the era of fully intelligent systems, as it has the potential to be used to develop systems that are able to make decisions based on data and information.
The chip model is also capable of being used in a variety of other scenarios, such as image processing, audio processing, and video processing. It can also be used to develop systems that are able to detect and recognize objects, as well as to develop systems that are able to interact with humans.
In order to meet the demands of the future, the XCV200-4BGG352C chip model must be able to adapt to new technologies. For instance, it must be able to handle the increasing amount of data that is being generated, as well as the increasing complexity of the tasks that it is being used for. It must also be able to take advantage of new technologies such as machine learning and artificial intelligence in order to provide the best possible results.
The XCV200-4BGG352C chip model is a powerful tool that can be used to create efficient and reliable systems. It is capable of being used in a variety of applications and networks, and can be used to create intelligent scenarios. It must be able to adapt to new technologies in order to meet the demands of the future, and it has the potential to be used in the era of fully intelligent systems.
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Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $46.4256 | $46.4256 |
10+ | $45.9264 | $459.2640 |
100+ | $43.4304 | $4,343.0400 |
1000+ | $40.9344 | $20,467.2000 |
10000+ | $37.4400 | $37,440.0000 |
The price is for reference only, please refer to the actual quotation! |