XCV200-4BGG352C
XCV200-4BGG352C
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rohs

AMD Xilinx

XCV200-4BGG352C


XCV200-4BGG352C
F20-XCV200-4BGG352C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

XCV200-4BGG352C ECAD Model


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XCV200-4BGG352C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 236666
Number of CLBs 1176
Combinatorial Delay of a CLB-Max 800 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1176 CLBS, 236666 GATES
Clock Frequency-Max 250 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B352
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 352
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description LBGA,
Pin Count 352

XCV200-4BGG352C Datasheet Download


XCV200-4BGG352C Overview



The XCV200-4BGG352C chip model is a high-performance digital signal processor, embedded processor, and image processor, and is designed to be used in the HDL language. It is a powerful tool that can be used to tackle complex tasks, allowing users to develop efficient and reliable systems.


This chip model has seen its applications expand over time, and is now being used in a variety of industries, such as automotive, aerospace, and medical. It has also been used in a variety of applications, such as machine learning, artificial intelligence, and robotics.


The chip model has the potential to be used in a variety of networks, and can be used to create intelligent scenarios. For instance, it can be used to develop autonomous vehicles, intelligent robots, and smart home systems. The chip model can also be used in the era of fully intelligent systems, as it has the potential to be used to develop systems that are able to make decisions based on data and information.


The chip model is also capable of being used in a variety of other scenarios, such as image processing, audio processing, and video processing. It can also be used to develop systems that are able to detect and recognize objects, as well as to develop systems that are able to interact with humans.


In order to meet the demands of the future, the XCV200-4BGG352C chip model must be able to adapt to new technologies. For instance, it must be able to handle the increasing amount of data that is being generated, as well as the increasing complexity of the tasks that it is being used for. It must also be able to take advantage of new technologies such as machine learning and artificial intelligence in order to provide the best possible results.


The XCV200-4BGG352C chip model is a powerful tool that can be used to create efficient and reliable systems. It is capable of being used in a variety of applications and networks, and can be used to create intelligent scenarios. It must be able to adapt to new technologies in order to meet the demands of the future, and it has the potential to be used in the era of fully intelligent systems.



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QTY Unit Price Ext Price
1+ $46.4256 $46.4256
10+ $45.9264 $459.2640
100+ $43.4304 $4,343.0400
1000+ $40.9344 $20,467.2000
10000+ $37.4400 $37,440.0000
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