
AMD Xilinx
XCV200-4BGG256I
XCV200-4BGG256I ECAD Model
XCV200-4BGG256I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 236666 | |
Number of CLBs | 1176 | |
Combinatorial Delay of a CLB-Max | 800 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1176 CLBS, 236666 GATES | |
Clock Frequency-Max | 250 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.55 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV200-4BGG256I Datasheet Download
XCV200-4BGG256I Overview
The XCV200-4BGG256I chip model is a high-performance, customizable digital signal processor (DSP) that is well-suited for a wide range of applications, including embedded processing, digital signal processing, and image processing. Its HDL-based design allows for greater flexibility and scalability, making it a popular choice for many of today's most advanced projects.
The XCV200-4BGG256I chip model offers a variety of advantages, including its low power consumption, high performance, and scalability. Its low power consumption makes it ideal for projects that require long-term operation, while its high performance allows for more complex calculations to be completed quickly and accurately. Additionally, its scalability allows for the chip to be used in a variety of different applications, making it a versatile choice for many projects.
As technology continues to advance, the demand for the XCV200-4BGG256I chip model is expected to grow. Its low power consumption, high performance, and scalability make it a valuable tool for many of today's digital projects, and its versatility makes it a great choice for a wide range of applications. Additionally, its HDL-based design makes it easier to customize, allowing for greater flexibility and scalability.
When designing with the XCV200-4BGG256I chip model, it is important to consider the specific design requirements of the project. Depending on the application, the design may require different amounts of memory, different clock speeds, and different input/output configurations. Additionally, it is important to consider the power consumption of the chip, as this can have a significant impact on the overall performance of the project.
When using the XCV200-4BGG256I chip model, there are a few precautions to keep in mind. First, it is important to ensure that the chip is properly cooled and not subjected to extreme temperatures. Additionally, the chip should be kept away from sources of electromagnetic interference, as this can cause errors in the chip's operation. Finally, it is important to ensure that the chip is properly powered, as this can affect the performance of the project.
In conclusion, the XCV200-4BGG256I chip model is a versatile and powerful digital signal processor that is well-suited for a variety of applications. Its low power consumption, high performance, and scalability make it a valuable tool for many digital projects, and its HDL-based design allows for greater flexibility and scalability. When designing with the XCV200-4BGG256I chip model, it is important to consider the specific design requirements of the project, as well as the power consumption and temperature requirements of the chip. Additionally, there are a few precautions to keep in mind when using the chip, such as avoiding sources of electromagnetic interference and ensuring that the chip is properly powered. With these considerations in mind, the XCV200-4BGG256I chip model can be a great choice for many digital projects.
You May Also Be Interested In
4,110 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $54.9072 | $54.9072 |
10+ | $54.3168 | $543.1680 |
100+ | $51.3648 | $5,136.4800 |
1000+ | $48.4128 | $24,206.4000 |
10000+ | $44.2800 | $44,280.0000 |
The price is for reference only, please refer to the actual quotation! |