AMD Xilinx
XCV200-4BGG256C
XCV200-4BGG256C ECAD Model
XCV200-4BGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 236666 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 236666 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200-4BGG256C Datasheet Download
XCV200-4BGG256C Overview
The XCV200-4BGG256C chip model is a powerful and versatile model that was designed with a wide range of applications in mind. It is a multi-purpose chip model that is capable of a variety of tasks, such as processing data, controlling peripherals, and communicating with other devices. The model is also capable of providing a high level of performance, making it suitable for use in advanced communication systems.
The XCV200-4BGG256C chip model is particularly well-suited for use in networks and intelligent scenarios. It can be used to enable intelligent systems to communicate and interact with each other in real-time, allowing for the development of sophisticated applications. It is also capable of being used in the era of fully intelligent systems, as it is able to process large amounts of data quickly and accurately.
The XCV200-4BGG256C chip model is also suitable for use in the development and popularization of future intelligent robots. The model is able to process a large amount of data quickly and accurately, allowing robots to respond quickly to commands and process information quickly. It is also capable of providing a high level of performance, making it suitable for use in advanced robotic applications.
In order to effectively use the XCV200-4BGG256C chip model, a certain level of technical expertise is required. The model is capable of performing complex tasks, and requires a certain level of knowledge and understanding of the various components and functions of the chip. Additionally, the model is capable of being upgraded and enhanced, allowing for the development of more advanced applications and capabilities.
Overall, the XCV200-4BGG256C chip model is a powerful and versatile model that is capable of a variety of tasks. It is suitable for use in advanced communication systems, networks, and intelligent scenarios, and can be used in the development and popularization of future intelligent robots. The model is also capable of being upgraded and enhanced, allowing for the development of more advanced applications and capabilities. However, the model does require a certain level of technical expertise in order to be used effectively.
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3,595 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $54.9072 | $54.9072 |
| 10+ | $54.3168 | $543.1680 |
| 100+ | $51.3648 | $5,136.4800 |
| 1000+ | $48.4128 | $24,206.4000 |
| 10000+ | $44.2800 | $44,280.0000 |
| The price is for reference only, please refer to the actual quotation! | ||