AMD Xilinx
XCV1600E-8FGG680I
XCV1600E-8FGG680I ECAD Model
XCV1600E-8FGG680I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 512 | |
| Number of Outputs | 512 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B680 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 680 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA680,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA680,39X39,40 | |
| Pin Count | 680 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1600E-8FGG680I Datasheet Download
XCV1600E-8FGG680I Overview
The chip model XCV1600E-8FGG680I is a high-performance chip model that is widely used in the industry. It has the advantages of high speed, low power consumption and high integration, which makes it an ideal choice for applications in various industries. In recent years, with the rapid development of artificial intelligence, the demand for chip models like XCV1600E-8FGG680I has been increasing.
In terms of the future development of related industries, the chip model XCV1600E-8FGG680I is expected to be widely used in various fields such as robotics, autonomous vehicles, and smart home applications. It is expected that the chip model will be further optimized to improve its performance and reduce its power consumption. In addition, the application environment may require the support of new technologies, such as machine learning, deep learning, and natural language processing.
As for the application of the chip model XCV1600E-8FGG680I in the development and popularization of future intelligent robots, the chip model has the potential to be used in the development of intelligent robots. It can be applied to control the movement of robots, process data from sensors, and provide the robot with the ability to learn and make decisions. In order to use the chip model effectively, technical talents such as software engineers, hardware engineers, and artificial intelligence experts are needed.
Overall, the chip model XCV1600E-8FGG680I is a powerful and versatile chip model that can be used in a wide range of applications. The demand for the chip model is expected to increase in the future due to the development of related industries, and the application environment may require the support of new technologies. The chip model can also be used in the development and popularization of future intelligent robots, and technical talents are needed to use the model effectively.
You May Also Be Interested In
2,630 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||