
AMD Xilinx
XCV1600E-8FGG680C
XCV1600E-8FGG680C ECAD Model
XCV1600E-8FGG680C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 512 | |
Number of Outputs | 512 | |
Number of Logic Cells | 34992 | |
Number of Equivalent Gates | 419904 | |
Number of CLBs | 7776 | |
Combinatorial Delay of a CLB-Max | 400 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 7776 CLBS, 419904 GATES | |
Clock Frequency-Max | 416 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B680 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 680 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA680,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 1.9 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA680,39X39,40 | |
Pin Count | 680 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV1600E-8FGG680C Datasheet Download
XCV1600E-8FGG680C Overview
The XCV1600E-8FGG680C chip model is an advanced, low-power, high-performance silicon chip developed by Xilinx, Inc. It is designed to meet the needs of the most demanding applications in the communications industry.
The XCV1600E-8FGG680C chip model is a single-chip solution for high-speed data processing, networking, and communications. It is based on the Xilinx Virtex-6 FPGA (Field Programmable Gate Array) architecture and features 8-bit FGG680C logic cells. This chip model is equipped with a high-speed transceiver, high-speed serializer/deserializer (SERDES) for high-speed data transfer, and a high-speed memory interface. It also features a clock management unit (CMU) for clock synchronization.
The XCV1600E-8FGG680C chip model offers a high level of flexibility and scalability, allowing it to be used in a wide range of applications. It can be used in high-speed networks, wireless networks, and intelligent systems. It is also capable of supporting advanced communication protocols such as Ethernet, Wi-Fi, and 3G/4G. Additionally, it can be used in the era of fully intelligent systems, allowing for the integration of artificial intelligence (AI) and machine learning (ML) algorithms.
The XCV1600E-8FGG680C chip model is designed to meet the requirements of advanced communication systems. It is capable of providing high-speed data transfer, low power consumption, and reliable performance. It is also equipped with a wide range of features, such as advanced encryption and authentication, error correction, and fault tolerance. Additionally, it is designed to be compatible with a wide range of operating systems and communication protocols.
When using the XCV1600E-8FGG680C chip model, it is important to consider the specific design requirements of the application. This includes the power requirements, the speed of the data transfer, and the type of communication protocols that need to be supported. Additionally, it is important to consider the environmental conditions in which the chip model will be used, as this will affect its performance.
In conclusion, the XCV1600E-8FGG680C chip model is an advanced, low-power, high-performance silicon chip developed by Xilinx, Inc. It is designed to meet the needs of the most demanding applications in the communications industry, and can be used in high-speed networks, wireless networks, and intelligent systems. It is also capable of supporting advanced communication protocols such as Ethernet, Wi-Fi, and 3G/4G. When using the XCV1600E-8FGG680C chip model, it is important to consider the specific design requirements of the application, as well as the environmental conditions in which the chip model will be used.
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