XCV1600E-8FGG680C
XCV1600E-8FGG680C
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rohs

AMD Xilinx

XCV1600E-8FGG680C


XCV1600E-8FGG680C
F20-XCV1600E-8FGG680C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA680,39X39,40
BGA, BGA680,39X39,40

XCV1600E-8FGG680C ECAD Model


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XCV1600E-8FGG680C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 512
Number of Outputs 512
Number of Logic Cells 34992
Number of Equivalent Gates 419904
Number of CLBs 7776
Combinatorial Delay of a CLB-Max 400 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 7776 CLBS, 419904 GATES
Clock Frequency-Max 416 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B680
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 680
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA680,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 1.9 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA680,39X39,40
Pin Count 680
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV1600E-8FGG680C Datasheet Download


XCV1600E-8FGG680C Overview



The XCV1600E-8FGG680C chip model is an advanced, low-power, high-performance silicon chip developed by Xilinx, Inc. It is designed to meet the needs of the most demanding applications in the communications industry.


The XCV1600E-8FGG680C chip model is a single-chip solution for high-speed data processing, networking, and communications. It is based on the Xilinx Virtex-6 FPGA (Field Programmable Gate Array) architecture and features 8-bit FGG680C logic cells. This chip model is equipped with a high-speed transceiver, high-speed serializer/deserializer (SERDES) for high-speed data transfer, and a high-speed memory interface. It also features a clock management unit (CMU) for clock synchronization.


The XCV1600E-8FGG680C chip model offers a high level of flexibility and scalability, allowing it to be used in a wide range of applications. It can be used in high-speed networks, wireless networks, and intelligent systems. It is also capable of supporting advanced communication protocols such as Ethernet, Wi-Fi, and 3G/4G. Additionally, it can be used in the era of fully intelligent systems, allowing for the integration of artificial intelligence (AI) and machine learning (ML) algorithms.


The XCV1600E-8FGG680C chip model is designed to meet the requirements of advanced communication systems. It is capable of providing high-speed data transfer, low power consumption, and reliable performance. It is also equipped with a wide range of features, such as advanced encryption and authentication, error correction, and fault tolerance. Additionally, it is designed to be compatible with a wide range of operating systems and communication protocols.


When using the XCV1600E-8FGG680C chip model, it is important to consider the specific design requirements of the application. This includes the power requirements, the speed of the data transfer, and the type of communication protocols that need to be supported. Additionally, it is important to consider the environmental conditions in which the chip model will be used, as this will affect its performance.


In conclusion, the XCV1600E-8FGG680C chip model is an advanced, low-power, high-performance silicon chip developed by Xilinx, Inc. It is designed to meet the needs of the most demanding applications in the communications industry, and can be used in high-speed networks, wireless networks, and intelligent systems. It is also capable of supporting advanced communication protocols such as Ethernet, Wi-Fi, and 3G/4G. When using the XCV1600E-8FGG680C chip model, it is important to consider the specific design requirements of the application, as well as the environmental conditions in which the chip model will be used.



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