AMD Xilinx
XCV1600E-8FGG1156I
XCV1600E-8FGG1156I ECAD Model
XCV1600E-8FGG1156I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 724 | |
| Number of Outputs | 724 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Pin Count | 1156 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1600E-8FGG1156I Datasheet Download
XCV1600E-8FGG1156I Overview
The XCV1600E-8FGG1156I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) to help developers create complex and sophisticated systems. With its high performance and reliable design, the chip model is ideal for a wide range of applications, from high-end embedded processing to image processing.
The XCV1600E-8FGG1156I chip model is also well-suited for use in networks and intelligent systems. Its ability to process digital signals quickly and accurately makes it ideal for network applications such as routers, switches, and firewalls. It can also be used to create intelligent systems such as autonomous vehicles, robotics, and artificial intelligence. The chip model can be used in the era of fully intelligent systems, allowing developers to create sophisticated and reliable systems.
The XCV1600E-8FGG1156I chip model has specific design requirements that must be followed to ensure its optimal performance. The chip model requires a high-speed clock frequency and a power supply voltage of 1.8V to 3.3V. It also has a wide range of input and output ports and can support up to 8-bit data width. Additionally, the chip model has a wide temperature range of -40°C to 85°C and can operate in a variety of environmental conditions.
Case studies of the XCV1600E-8FGG1156I chip model have been conducted to demonstrate its reliability and performance. These studies have shown that the chip model can be used in a variety of applications and can handle complex tasks with ease. Additionally, the studies have shown that the chip model can be used in a variety of environmental conditions and can handle high amounts of data without any issues.
When using the XCV1600E-8FGG1156I chip model, it is important to follow the design requirements and take the necessary precautions. It is important to ensure that the chip model is operated within the specified temperature and voltage ranges. Additionally, it is important to ensure that the chip model is not exposed to any static electricity or magnetic fields, as these can cause damage to the chip model. Finally, it is important to ensure that the chip model is not exposed to any extreme temperatures or humidity levels, as this can cause the chip model to malfunction.
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