AMD Xilinx
XCV1600E-8FGG1156C
XCV1600E-8FGG1156C ECAD Model
XCV1600E-8FGG1156C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 724 | |
| Number of Outputs | 724 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Pin Count | 1156 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1600E-8FGG1156C Datasheet Download
XCV1600E-8FGG1156C Overview
The chip model XCV1600E-8FGG1156C is a cutting-edge technology in the semiconductor industry. It has been developed to provide high performance, low power consumption and cost-effectiveness for the applications in networks. As the technology advances, the model is expected to become even more powerful and cost-effective in the future.
The chip model XCV1600E-8FGG1156C is capable of supporting a wide range of intelligent scenarios, from the most basic to the most advanced. It can be used to build intelligent networks, as well as to develop and popularize future intelligent robots. It can also be used to facilitate the development of fully intelligent systems.
In terms of industry trends, the chip model XCV1600E-8FGG1156C is expected to be widely adopted in the near future. As the technology advances, new technologies may be required to support the application environment. This may include technologies such as artificial intelligence, machine learning, and natural language processing.
In terms of technical talent, those who are well-versed in the chip model XCV1600E-8FGG1156C and related technologies will be in high demand. They will be able to use the model effectively and develop innovative solutions for the applications in networks and intelligent robots. Moreover, they will also be able to help in the development and popularization of future intelligent systems.
In conclusion, the chip model XCV1600E-8FGG1156C is a cutting-edge technology in the semiconductor industry. It is expected to be widely adopted in the near future and to be used in networks and intelligent robots. New technologies may be required to support the application environment, and those who are well-versed in the chip model and related technologies will be in high demand.
You May Also Be Interested In
4,683 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||