AMD Xilinx
XCV1600E-8FG900I
XCV1600E-8FG900I ECAD Model
XCV1600E-8FG900I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 700 | |
| Number of Outputs | 700 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-900 | |
| Pin Count | 900 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV1600E-8FG900I Datasheet Download
XCV1600E-8FG900I Overview
The XCV1600E-8FG900I chip model is a powerful, versatile and highly efficient processor that is suitable for a range of applications. It is ideal for high-performance digital signal processing, embedded processing and image processing, and requires the use of HDL language. As a result, this chip model is an ideal choice for a range of applications, from networks to intelligent systems.
In the era of fully-intelligent systems, the XCV1600E-8FG900I chip model could be used to facilitate the development and popularization of future intelligent robots. It is capable of performing complex tasks quickly and efficiently, making it ideal for use in robots that require a high level of intelligence. Furthermore, the chip model is capable of being programmed in HDL language, meaning that it is both easy to use and highly versatile, allowing for greater flexibility in the development of intelligent robots.
In order to use the XCV1600E-8FG900I chip model effectively, it is important to have the right technical talents. This includes knowledge of HDL language, as well as experience in programming and debugging. Additionally, knowledge of robotics and artificial intelligence is also beneficial, as this will help to ensure that the chip model is used to its fullest potential. With the right technical talents, the XCV1600E-8FG900I chip model can be used to great effect in the development and popularization of future intelligent robots.
You May Also Be Interested In
4,043 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $652.3048 | $652.3048 |
| 10+ | $645.2908 | $6,452.9076 |
| 100+ | $610.2206 | $61,022.0610 |
| 1000+ | $575.1505 | $287,575.2300 |
| 10000+ | $526.0523 | $526,052.2500 |
| The price is for reference only, please refer to the actual quotation! | ||