XCV1600E-8FG1156C

The XCV1600E-8FG1156C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It has a capacity of 1.6 million logic cells, and is designed to be used in a wide range of applications.

The chip is built on a 28nm process technology and is available in a variety of packages, including a FineLine BGA package, which is suitable for high-density applications. It has a total of 1156 I/O pins, and is capable of delivering up to 8.5 Gbps of data transfer rate. The chip also features high-speed transceivers and a variety of I/O standards, including LVDS, LVPECL, SSTL, and HSTL.

The XCV1600E-8FG1156C is ideal for applications such as high-performance computing, embedded systems, industrial automation, medical imaging, and communications. It is also suitable for applications that require high-speed data transfer and low power consumption. In addition, the chip has built-in features such as error correction, secure boot, and encryption, which makes it suitable for secure applications.

Overall, the XCV1600E-8FG1156C is a powerful, feature-rich FPGA chip that can be used in a wide range of applications. It has a wide range of I/O pins and high-speed transceivers, and is capable of delivering up to 8.5 Gbps of data transfer rate. It also has built-in features such as error correction, secure boot, and encryption, making it suitable for secure applications.