AMD Xilinx
XCV1600E-7FGG900I
XCV1600E-7FGG900I ECAD Model
XCV1600E-7FGG900I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 700 | |
| Number of Outputs | 700 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA900,30X30,40 | |
| Pin Count | 900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV1600E-7FGG900I Datasheet Download
XCV1600E-7FGG900I Overview
The XCV1600E-7FGG900I chip model is a powerful and reliable processor designed for high-performance digital signal processing, embedded processing, and image processing applications. It is equipped with advanced features and capabilities that make it an ideal choice for those requiring a high-performance processor.
This chip model is built with a high-speed processor core and provides a wide range of options for the user. It can be used with a range of HDL (Hardware Description Language) languages, allowing for more efficient and cost-effective development. It also offers high-performance memory and storage options, allowing for fast and reliable data processing.
The XCV1600E-7FGG900I chip model is a great choice for those who need a powerful and reliable processor for their applications. Its high-performance capabilities make it a great choice for applications requiring high-performance digital signal processing, embedded processing, and image processing. Its wide range of features and options make it an ideal choice for those needing a powerful processor for their applications.
The XCV1600E-7FGG900I chip model is expected to be in high demand in the future. Its powerful capabilities, wide range of features, and ability to use HDL languages make it a great choice for those who need a powerful and reliable processor for their applications. With its wide range of features and options, the XCV1600E-7FGG900I chip model is sure to be a popular choice for those needing a powerful and reliable processor.
When designing with the XCV1600E-7FGG900I chip model, it is important to consider the specific design requirements of the application. The processor should be chosen based on the specific requirements of the application, such as the speed and power requirements, as well as the type of language that will be used. Additionally, when designing with the XCV1600E-7FGG900I chip model, it is important to consider the actual case studies and precautions that may be necessary.
In conclusion, the XCV1600E-7FGG900I chip model is a powerful and reliable processor for high-performance digital signal processing, embedded processing, and image processing applications. Its high-performance capabilities, wide range of features, and ability to use HDL languages make it a great choice for those needing a powerful and reliable processor for their applications. When designing with the XCV1600E-7FGG900I chip model, it is important to consider the specific design requirements of the application, as well as the actual case studies and precautions that may be necessary. The XCV1600E-7FGG900I chip model is expected to be in high demand in the future, making it a great choice for those needing a powerful and reliable processor.
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