AMD Xilinx
XCV1600E-7FGG900C
XCV1600E-7FGG900C ECAD Model
XCV1600E-7FGG900C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 700 | |
| Number of Outputs | 700 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA900,30X30,40 | |
| Pin Count | 900 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XCV1600E-7FGG900C Datasheet Download
XCV1600E-7FGG900C Overview
The chip model XCV1600E-7FGG900C is a high-performance, low-power, and cost-effective chip designed to meet the needs of a variety of applications. It is specifically designed to support the latest technologies and is suitable for a wide range of applications, including network, intelligent systems, and other scenarios.
In terms of industry trends, the chip model XCV1600E-7FGG900C is expected to become increasingly popular due to its cost-effectiveness and low power consumption. With the advent of 5G, the demand for low-power, high-performance chips is expected to continue to grow, making the XCV1600E-7FGG900C an ideal choice for many applications.
In terms of potential applications, the XCV1600E-7FGG900C is suitable for use in networks, intelligent systems, and other scenarios. It is capable of supporting the latest technologies and can be used in a variety of applications. In the era of fully intelligent systems, the XCV1600E-7FGG900C can be used to support the development and deployment of intelligent systems, making it an ideal choice for many applications.
In terms of product description and design requirements, the XCV1600E-7FGG900C is designed to be low-power, high-performance, and cost-effective. It is capable of supporting a wide range of technologies and can be used in a variety of applications. In terms of actual case studies, the XCV1600E-7FGG900C has been successfully used in a variety of applications, including network and intelligent systems. Finally, when using the XCV1600E-7FGG900C, it is important to ensure that the necessary precautions are taken to ensure the proper operation of the chip.
In conclusion, the XCV1600E-7FGG900C is an ideal choice for many applications, due to its cost-effectiveness, low power consumption, and ability to support the latest technologies. It is suitable for use in networks, intelligent systems, and other scenarios, and can be used in the era of fully intelligent systems. When using the XCV1600E-7FGG900C, it is important to take the necessary precautions to ensure proper operation.
You May Also Be Interested In
3,594 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||