AMD Xilinx
XCV1600E-7BGG560I
XCV1600E-7BGG560I ECAD Model
XCV1600E-7BGG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA560,33X33,50 | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1600E-7BGG560I Datasheet Download
XCV1600E-7BGG560I Overview
The XCV1600E-7BGG560I chip model is a powerful and versatile processor, designed to deliver high performance digital signal processing, embedded processing, and image processing capabilities. Its design is based on a high-performance, low-power architecture, with the ability to support multiple applications and future upgrades.
The XCV1600E-7BGG560I chip model is designed to make use of HDL (Hardware Description Language) for its programming. This language is a powerful tool for embedded system design and can be used to create complex systems with a high degree of precision. This makes the XCV1600E-7BGG560I chip model an ideal choice for advanced communication systems, as it can be used to create and maintain sophisticated communication networks.
The XCV1600E-7BGG560I chip model also has the potential to be applied to the development and popularization of future intelligent robots. Its powerful processing capabilities can be used to create complex algorithms that can be used to power autonomous robots. This could be used in a variety of settings, from manufacturing and industrial applications to home robotics.
To make use of the XCV1600E-7BGG560I chip model effectively, a variety of technical talents are needed. This includes engineers with experience in embedded systems design, as well as those with knowledge of HDL programming. Additionally, experience in robotics and machine learning can be beneficial in creating powerful algorithms that can be used to power autonomous robots.
In conclusion, the XCV1600E-7BGG560I chip model is a powerful and versatile processor that can be used to create sophisticated communication systems and autonomous robots. To make use of the chip model effectively, a variety of technical talents are needed, including engineers with experience in embedded systems design and HDL programming, as well as those with knowledge of robotics and machine learning.
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