AMD Xilinx
XCV1600E-7BGG560C
XCV1600E-7BGG560C ECAD Model
XCV1600E-7BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA560,33X33,50 | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1600E-7BGG560C Datasheet Download
XCV1600E-7BGG560C Overview
The XCV1600E-7BGG560C chip model is a powerful and reliable processor that is designed to meet the stringent demands of a wide range of applications. Developed by a leading semiconductor company, this model is a high-performance processor that offers a wide range of features and capabilities. It is suitable for use in a variety of industries, including consumer electronics, automotive, and industrial automation.
The XCV1600E-7BGG560C chip model is designed to meet the needs of today's digital world. It offers a wide range of features and capabilities, including high-speed data processing, low-power consumption, and excellent performance. Additionally, the chip model is designed to be highly reliable and durable. It is also designed to be compatible with a wide range of operating systems and can be used in a variety of applications.
The XCV1600E-7BGG560C chip model is designed with the intention of being a reliable and cost-effective solution for a wide range of applications. It is expected that the demand for this model will continue to grow in the future, as more and more industries adopt the technology. Additionally, the chip model is designed to be upgradable, allowing for future upgrades to be made to the model, should the application environment require it.
The XCV1600E-7BGG560C chip model is also designed to be compatible with advanced communication systems. This allows for the model to be used in applications such as wireless networks, cellular networks, and satellite communication systems. Additionally, the chip model is designed to be able to support a wide range of technologies, including LTE, Wi-Fi, and Bluetooth.
Overall, the XCV1600E-7BGG560C chip model is a powerful and reliable processor that is designed to meet the stringent demands of a wide range of applications. It is expected that the demand for this model will continue to grow in the future, as more and more industries adopt the technology. Additionally, the chip model is designed to be upgradable, allowing for future upgrades to be made to the model, should the application environment require it. Furthermore, the chip model is designed to be compatible with advanced communication systems and can support a wide range of technologies.
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|---|---|---|
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