AMD Xilinx
XCV1600E-7BG560C
XCV1600E-7BG560C ECAD Model
XCV1600E-7BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | AMD Xilinx | |
| Series | Virtex®-E | |
| Package | Tray | |
| Number of LABs/CLBs | 7776 | |
| Number of Logic Elements/Cells | 34992 | |
| Total RAM Bits | 589824 | |
| Number of I/O | 404 | |
| Number of Gates | 2188742 | |
| Voltage - Supply | 1.71V ~ 1.89V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 560-LBGA Exposed Pad, Metal | |
| Supplier Device Package | 560-MBGA (42.5x42.5) | |
| Base Product Number | XCV1600E |
XCV1600E-7BG560C Datasheet Download
XCV1600E-7BG560C Overview
The XCV1600E-7BG560C is a Field Programmable Gate Array (FPGA) from Xilinx, which is based on the Virtex-7 family. It is a high-end device, with a capacity of 15,360 logic cells, 1.3 million system gates, and 5,600 Kbits of block RAM. The device also features two hardened Gigabit Ethernet MACs, two hardened PCI Express x8 Gen3 blocks, two hardened 10G Ethernet MACs, two hardened USB 3.0/2.0 blocks, two hardened SATA blocks and four hardened DDR3/DDR4 memory controllers. It has a total of 740 I/Os with support for various single-ended and differential I/O standards.
The XCV1600E-7BG560C has an operating temperature range of -40°C to +100°C, and a power consumption of up to 16W. It is available in a variety of packages, including a 776-pin BGA package.
The XCV1600E-7BG560C is suitable for a wide range of applications, including industrial automation, medical imaging, video surveillance, automotive, aerospace, defense, and high-performance computing. It can also be used for high-end networking, storage, and embedded systems. With its high performance and flexibility, the XCV1600E-7BG560C is an ideal choice for a variety of challenging applications.
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