AMD Xilinx
XCV1600E-6FGG900I
XCV1600E-6FGG900I ECAD Model
XCV1600E-6FGG900I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 700 | |
| Number of Outputs | 700 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA900,30X30,40 | |
| Pin Count | 900 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XCV1600E-6FGG900I Datasheet Download
XCV1600E-6FGG900I Overview
The chip model XCV1600E-6FGG900I is a new product in the semiconductor industry, and its development has brought about a new trend in the industry. It is a high-performance and low-power chip, which has the characteristics of high integration and low power consumption, and it is also highly reliable, making it suitable for many applications.
The XCV1600E-6FGG900I chip has a variety of features that make it attractive for use in various industries. It has a high-speed interface, which enables it to process data quickly and efficiently. It also has a low-power design, which allows it to be used in applications where power consumption must be kept to a minimum. Furthermore, the chip has a high level of integration, which allows it to be used in a variety of applications, including networks, intelligent systems, and other applications.
The chip model XCV1600E-6FGG900I is expected to be widely used in the future in various industries and applications. It is expected to be used in networks, where it can be used to provide high-speed data transfer and communication. It is also expected to be used in intelligent systems, where it can be used to provide the necessary processing power and intelligence to enable the system to function properly. Furthermore, the chip may be used in the era of fully intelligent systems, where it can provide the necessary processing power and intelligence to enable the system to function properly.
Overall, the chip model XCV1600E-6FGG900I is expected to be widely used in the future in various industries and applications. It is expected to be used in networks, intelligent systems, and the era of fully intelligent systems. It is also expected to provide the necessary processing power and intelligence to enable the system to function properly. The chip model XCV1600E-6FGG900I is expected to be a major player in the future of the semiconductor industry, and its development is likely to bring about a new trend in the industry.
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