AMD Xilinx
XCV1600E-6FGG900C
XCV1600E-6FGG900C ECAD Model
XCV1600E-6FGG900C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 700 | |
| Number of Outputs | 700 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA900,30X30,40 | |
| Pin Count | 900 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XCV1600E-6FGG900C Datasheet Download
XCV1600E-6FGG900C Overview
The chip model XCV1600E-6FGG900C is a cutting-edge technology that is designed to meet the needs of today's rapidly changing technology landscape. Developed by Xilinx, the chip model is designed to provide high-performance, low-cost, and reliable solutions for a variety of applications. It is a versatile, low-power, and highly configurable chip model that can be used in a variety of scenarios.
The chip model XCV1600E-6FGG900C is designed to meet the needs of the current market. It features a vast array of features that make it suitable for a variety of applications, including high-performance computing, low-power communication, and low-cost solutions. It is also designed to provide an efficient and reliable solution for applications that require high-speed data transfer and low-cost solutions.
The chip model XCV1600E-6FGG900C is also designed to be highly configurable and upgradable. This allows the chip model to be used in a variety of scenarios and applications. It is also designed to be able to support new technologies that may be needed in the future. This allows the chip model to be used in applications that require new technologies, such as advanced communication systems.
The chip model XCV1600E-6FGG900C is also designed to be used in a variety of networks and intelligent scenarios. It is designed to be used in the era of fully intelligent systems, with features that make it suitable for applications such as machine learning and artificial intelligence. The chip model is also designed to be used in a variety of communication networks, making it suitable for applications such as 5G networks.
The chip model XCV1600E-6FGG900C is designed to meet the needs of the current market and is designed to be highly configurable and upgradable. This allows the chip model to be used in a variety of scenarios and applications, including high-performance computing, low-power communication, and low-cost solutions. It is also designed to be able to support new technologies that may be needed in the future, making it suitable for applications such as advanced communication systems and 5G networks. The chip model is also designed to be used in a variety of intelligent scenarios, making it suitable for applications such as machine learning and artificial intelligence.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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