AMD Xilinx
XCV1600E-6FGG680C
XCV1600E-6FGG680C ECAD Model
XCV1600E-6FGG680C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 512 | |
| Number of Outputs | 512 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B680 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 680 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA680,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA680,39X39,40 | |
| Pin Count | 680 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1600E-6FGG680C Datasheet Download
XCV1600E-6FGG680C Overview
The chip model XCV1600E-6FGG680C is a powerful and versatile model that offers a wide range of advantages for users in related industries. It is a highly reliable and cost-effective model that offers a wide range of features and functions, making it an ideal choice for companies looking to upgrade their systems. With its impressive performance and scalability, the model is expected to be in high demand in the future.
The XCV1600E-6FGG680C is a great choice for applications in networks, as it is capable of providing high-speed data transmission and can be used in a variety of scenarios. It is also suitable for use in intelligent systems, as it has the ability to process data quickly and accurately. The model can be used in a variety of intelligent scenarios, such as facial recognition, natural language processing, and image recognition. It is also capable of handling large volumes of data and can be used in fully intelligent systems.
The XCV1600E-6FGG680C is an ideal choice for the development and popularization of future intelligent robots. It is capable of handling complex tasks and can provide a high level of accuracy and reliability. In order to use the model effectively, it is important to have a good understanding of the chip's features and functions, as well as a solid understanding of the underlying algorithms and technologies. Technical talents such as software developers, hardware engineers, and data scientists are needed to use the model effectively.
In conclusion, the XCV1600E-6FGG680C is a powerful and versatile chip model that offers a wide range of advantages for users in related industries. It is expected to be in high demand in the future due to its impressive performance and scalability. It is suitable for use in networks and intelligent systems, and can be used for the development and popularization of future intelligent robots. In order to use the model effectively, it is important to have a good understanding of the chip's features and functions, as well as a solid understanding of the underlying algorithms and technologies. Technical talents such as software developers, hardware engineers, and data scientists are needed to use the model effectively.
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|---|---|---|
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