AMD Xilinx
XCV1600E-6FGG1156C
XCV1600E-6FGG1156C ECAD Model
XCV1600E-6FGG1156C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 724 | |
| Number of Outputs | 724 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Pin Count | 1156 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XCV1600E-6FGG1156C Datasheet Download
XCV1600E-6FGG1156C Overview
The chip model XCV1600E-6FGG1156C is a highly advanced integrated circuit (IC) designed for use in a variety of communication systems. It is a single-chip solution that integrates a variety of components and technologies, including a high-performance processor, high-speed memory, and a range of digital and analog interfaces. This makes it ideal for applications such as wireless communication, digital satellite systems, and other embedded systems.
The XCV1600E-6FGG1156C is designed to be highly efficient and reliable, with a low power consumption. It is also designed to be highly scalable, allowing for future upgrades and modifications to meet the needs of different applications and environments. This makes it suitable for use in advanced communication systems where high-speed data transmission and low power consumption are essential.
The XCV1600E-6FGG1156C is also designed to be highly flexible, allowing for the integration of different technologies and components. This allows the chip to be used in a variety of different applications, from wireless communication to digital satellite systems. It can also be used in embedded systems, where it can be used to control various devices and equipment.
In terms of industry trends, the XCV1600E-6FGG1156C is designed to be highly compatible with a range of different technologies, including Bluetooth, Wi-Fi, and LTE. This makes it suitable for use in a variety of different applications, from consumer electronics to industrial automation. It is also designed to be highly reliable, with a low power consumption and a high level of performance.
The product description of the XCV1600E-6FGG1156C includes a range of features, such as a high-performance processor, high-speed memory, and a range of digital and analog interfaces. It also includes a range of safety and security features, such as ECC and secure boot. In addition, it is designed to be highly reliable, with a low power consumption and a high level of performance.
In terms of actual case studies, the XCV1600E-6FGG1156C has been used in a wide range of applications, from consumer electronics to industrial automation. For example, it has been used in the development of a Bluetooth-enabled smart home system, as well as in the development of a digital satellite system. In both cases, the XCV1600E-6FGG1156C provided reliable and efficient performance, as well as a low power consumption.
In terms of precautions, it is important to ensure that the XCV1600E-6FGG1156C is used in a secure environment. It is also important to ensure that the chip is used in an environment that is compatible with the technologies and components that it is designed to support. Additionally, it is important to ensure that the chip is used in an environment that is suitable for its intended purpose.
Overall, the XCV1600E-6FGG1156C is a highly advanced integrated circuit designed for use in a variety of communication systems. It is designed to be highly efficient and reliable, with a low power consumption and a high level of performance. It is also designed to be highly compatible with a range of different technologies, including Bluetooth, Wi-Fi, and LTE. It is also designed to be highly reliable, with a range of safety and security features. Finally, it is important to ensure that the chip is used in an environment that is suitable for its intended purpose and compatible with the technologies and components that it is designed to support.
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