XCV1600E-6FG900I
XCV1600E-6FG900I
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AMD Xilinx

XCV1600E-6FG900I


XCV1600E-6FG900I
F20-XCV1600E-6FG900I
Active
IC FPGA 700 I/O 900FBGA
900-FBGA (31x31)

XCV1600E-6FG900I ECAD Model


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XCV1600E-6FG900I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 7776
Number of Logic Elements/Cells 34992
Total RAM Bits 589824
Number of I/O 700
Number of Gates 2188742
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FBGA (31x31)
Base Product Number XCV1600E

XCV1600E-6FG900I Datasheet Download


XCV1600E-6FG900I Overview



The XCV1600E-6FG900I is a high-performance, low-power FPGA chip from Xilinx. It is based on the Virtex-6 family and is capable of delivering up to 300K logic cells and up to 900Kbits of embedded memory. It also offers up to 30MB of distributed RAM, 6 independent clock sources, and up to 6 high-speed serial transceivers.


The XCV1600E-6FG900I is designed to be used in a variety of applications, including high-speed networking, data storage, and image processing. It is also well-suited for embedded systems, industrial automation, automotive, and military applications.


The chip offers a wide range of features, including high-speed transceivers, low-power operation, and high-performance logic. It also offers a wide range of I/O options, including LVDS, PCI Express, and Gigabit Ethernet. Additionally, the chip supports multiple clock domains, allowing for improved timing control and synchronization.


The XCV1600E-6FG900I is also designed to be highly configurable, allowing users to customize the chip to their specific application needs. It also features advanced power management features, such as dynamic power management and adaptive clocking. This helps to reduce power consumption and increase system performance.


Overall, the XCV1600E-6FG900I is a highly capable FPGA chip that is well-suited for a variety of applications. It offers a wide range of features, including high-speed transceivers, low-power operation, and high-performance logic. Additionally, the chip is highly configurable and supports advanced power management features.



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