XCV1600E-6FG900C
XCV1600E-6FG900C
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AMD Xilinx

XCV1600E-6FG900C


XCV1600E-6FG900C
F20-XCV1600E-6FG900C
Active
IC FPGA 700 I/O 900FBGA
900-FBGA (31x31)

XCV1600E-6FG900C ECAD Model


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XCV1600E-6FG900C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 7776
Number of Logic Elements/Cells 34992
Total RAM Bits 589824
Number of I/O 700
Number of Gates 2188742
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FBGA (31x31)
Base Product Number XCV1600E

XCV1600E-6FG900C Datasheet Download


XCV1600E-6FG900C Overview



The XCV1600E-6FG900C is a high-performance, low-power field-programmable gate array (FPGA) chip designed by Xilinx. It is part of the Virtex-E family of FPGAs and is based on the Virtex-E platform. The XCV1600E-6FG900C is a 6-million gate device, with 900k logic cells and 6.4Mb of embedded SRAM. It has a maximum power dissipation of 9W and is capable of operating at up to 200MHz.


The XCV1600E-6FG900C features a range of I/O options including LVDS, LVPECL, and SSTL-2. It also has a wide variety of high-speed serial transceivers, with support for up to 16 channels of gigabit Ethernet, 8 channels of Serial RapidIO, and 8 channels of PCI Express. The chip also includes a range of dedicated hardware blocks, such as a DSP core, a System Monitor, and a Clock Management Unit.


The XCV1600E-6FG900C is suitable for a wide range of applications, including embedded systems, communications, industrial automation, medical imaging, and automotive. It is also well-suited for high-performance computing, data acquisition, and signal processing applications. The chip is available in a range of packages, including the FG900C, the FG900C-Q, and the FG900C-QV.



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QTY Unit Price Ext Price
1+ $1,422.2304 $1,422.2304
10+ $1,406.9376 $14,069.3760
100+ $1,330.4736 $133,047.3600
1000+ $1,254.0096 $627,004.8000
10000+ $1,146.9600 $1,146,960.0000
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