
AMD Xilinx
XCV150-6FGG456I
XCV150-6FGG456I ECAD Model
XCV150-6FGG456I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 164674 | |
Number of CLBs | 864 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 864 CLBS, 164674 GATES | |
Clock Frequency-Max | 333 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 456 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV150-6FGG456I Datasheet Download
XCV150-6FGG456I Overview
The chip model XCV150-6FGG456I is a new product from the semiconductor industry, and it has been gaining popularity due to its excellent performance and high cost-efficiency. It is designed to provide a reliable and cost-effective solution for a wide range of applications and is suitable for use in a variety of industries.
The XCV150-6FGG456I chip model is a cost-effective, low-power, high-performance integrated circuit with a wide range of features. It has a wide range of features, including a high-speed transceiver, low-power voltage regulator, high-speed memory controller, and ultra-low-power analog-to-digital converter. It is also equipped with a wide range of peripheral interfaces, such as a USB 2.0 interface, a UART interface, and an I2C interface.
In terms of performance, the XCV150-6FGG456I chip model can provide up to 150 MHz of processing power, allowing it to handle a wide range of tasks with ease. It also has a low power consumption, making it an ideal choice for battery-powered applications. Additionally, the chip model is designed to be highly reliable and robust, making it suitable for long-term use in industrial applications.
The XCV150-6FGG456I chip model is expected to be a popular choice in the future, as it is well-suited for a variety of applications. It is expected to be used in medical, automotive, industrial, and consumer electronics applications, as well as in the development of new technologies. The chip model is also expected to be used in the development of new technologies, such as artificial intelligence, machine learning, and the internet of things.
The XCV150-6FGG456I chip model is designed to meet the specific needs of its users. It is designed with a wide range of features, such as an on-chip power management system, a wide range of peripheral interfaces, and a low-power voltage regulator. Additionally, the chip model is designed to be highly reliable and robust, making it suitable for long-term use in industrial applications.
In order to ensure the successful implementation of the XCV150-6FGG456I chip model, it is important to consider the application environment and the specific design requirements of the chip model. It is also important to consider the advantages and disadvantages of the chip model, as well as the expected demand trends for the model in related industries in the future. Additionally, actual case studies and precautions should be taken into account when implementing the chip model.
Overall, the XCV150-6FGG456I chip model is a cost-effective, low-power, and high-performance integrated circuit that is suitable for use in a variety of applications. It is expected to be a popular choice in the future, as it is well-suited for a variety of applications. In order to ensure the successful implementation of the chip model, it is important to consider the application environment and the specific design requirements of the chip model, as well as the advantages and disadvantages of the chip model, and the expected demand trends for the model in related industries in the future.
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Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $197.3082 | $197.3082 |
10+ | $195.1866 | $1,951.8665 |
100+ | $184.5787 | $18,457.8678 |
1000+ | $173.9707 | $86,985.3540 |
10000+ | $159.1196 | $159,119.5500 |
The price is for reference only, please refer to the actual quotation! |