AMD Xilinx
XCV150-6FGG456C
XCV150-6FGG456C ECAD Model
XCV150-6FGG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 164674 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 164674 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV150-6FGG456C Datasheet Download
XCV150-6FGG456C Overview
The chip model XCV150-6FGG456C is an advanced technology that has been developed to meet the needs of the modern technological age. This chip model is designed to provide a variety of features that can be used in a wide range of applications. It is a highly advanced and reliable chip model that has been designed to meet the needs of the modern industry.
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The chip model XCV150-6FGG456C is expected to be in high demand in the future due to its advanced features and reliable performance. It is a highly advanced and reliable chip model that has been designed to meet the needs of the modern industry. It is capable of providing high performance, low power consumption, and high reliability in a wide range of applications. The chip model XCV150-6FGG456C is expected to be in high demand in the future due to its advanced features and reliable performance.
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In order to determine whether the application environment requires the support of new technologies, it is important to understand the specific technologies that are needed. Different technologies may be required for different applications, and the specific technologies that are required should be carefully studied in order to ensure that the chip model XCV150-6FGG456C is suitable for the application environment.
In conclusion, the chip model XCV150-6FGG456C is a highly advanced and reliable chip model that has been designed to meet the needs of the modern industry. It is expected to be in high demand in the future due to its advanced features and reliable performance. It is important to understand the specific technologies that are needed in order to determine whether the application environment requires the support of new technologies. The product description and specific design requirements of the chip model XCV150-6FGG456C, along with actual case studies and precautions, should be thoroughly studied in order to ensure that the chip model is suitable for the application environment.
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3,059 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $197.3082 | $197.3082 |
| 10+ | $195.1866 | $1,951.8665 |
| 100+ | $184.5787 | $18,457.8678 |
| 1000+ | $173.9707 | $86,985.3540 |
| 10000+ | $159.1196 | $159,119.5500 |
| The price is for reference only, please refer to the actual quotation! | ||