AMD Xilinx
XCV150-6FGG256I
XCV150-6FGG256I ECAD Model
XCV150-6FGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 164674 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 164674 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV150-6FGG256I Datasheet Download
XCV150-6FGG256I Overview
The XCV150-6FGG256I chip model is a powerful and reliable solution for high-performance digital signal processing, embedded processing, and image processing. This model is designed to be used with a hardware description language (HDL) to ensure the best performance. It is an ideal choice for a variety of applications, including industrial automation, medical imaging, and military applications.
The XCV150-6FGG256I chip model is equipped with a number of features that make it a great choice for any project. It has a high-speed processor and an advanced memory system that provide excellent performance. It also has a wide range of peripherals, such as USB and Ethernet ports, that make it easy to connect to external devices. The chip model also has a robust power management system that helps to reduce power consumption and increase system efficiency.
The XCV150-6FGG256I chip model is also designed to be highly reliable. It is designed to withstand extreme temperatures and harsh environments, making it a great choice for applications that require reliability. Additionally, the chip model is designed to be easy to use and configure, allowing for quick and easy integration into a variety of applications.
The demand for the XCV150-6FGG256I chip model is expected to continue to grow in the future. The chip model is highly versatile and can be used in a variety of applications, making it a great choice for many industries. Additionally, the chip model is designed to be highly reliable and efficient, making it a great choice for applications that require reliability and efficiency.
When designing a project that requires the XCV150-6FGG256I chip model, it is important to consider the specific design requirements. The chip model should be designed to meet the specific needs of the application. Additionally, the design should be tested and verified to ensure that the chip model is working correctly. Additionally, it is important to consider the environmental conditions of the application, as the chip model may need to be able to withstand extreme temperatures and harsh environments.
Case studies of successful projects that have used the XCV150-6FGG256I chip model can be used to help inform the design of a new project. These case studies can provide insight into the design requirements, as well as any potential issues that may arise. Additionally, these case studies can help to provide an understanding of the expected performance of the chip model.
Overall, the XCV150-6FGG256I chip model is a great choice for a variety of applications. It is designed to be highly reliable and efficient, making it a great choice for applications that require reliability and efficiency. Additionally, the chip model is designed to be easy to use and configure, allowing for quick and easy integration into a variety of applications. The demand for the XCV150-6FGG256I chip model is expected to continue to grow in the future, making it a great choice for many industries. When designing a project that requires the XCV150-6FGG256I chip model, it is important to consider the specific design requirements, as well as any potential issues that may arise. Additionally, case studies of successful projects can provide insight into the design requirements and expected performance of the chip model.
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